By doping an organic compound functioning as an electron donor (hereinafter referred to as donor molecules) into an organic compound layer contacting a cathode, donor levels can be formed between respective LUMO (lowest unoccupied molecular orbital) levels between the cathode and the organic compound layer, and therefore electrons can be injected from the cathode, and transmission of the injected electrons can be performed with good efficiency. Further, there are no problems such as excessive energy loss, deterioration of the organic compound layer itself, and the like accompanying electron movement, and therefore an increase in the electron injecting characteristics and a decrease in the driver voltage can both be achieved without depending on the work function of the cathode material.

Light Emitting Device

The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Printed circuit board and manufacturing method thereof

A stacked-chip apparatus includes a package substrate and an interposer with a chip stack disposed with a standoff that matches the interposer. A package-on-package stacked-chip apparatus includes a top package disposed on the interposer.

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.

Wiring board and method for manufacturing the same

A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface and a second surface. A plurality of input and output pads are formed on one of the first and second surfaces. The circuit board comprises a thin film having a first surface and a second surface and being provided with a center hole in which the semiconductor chip is positioned, a plurality of circuit patterns being formed on the first surface of the thin film and including a plurality of bond fingers and ball lands, and a cover coat covering the circuit board except for the bond fingers and the ball lands. The electric connection means electrically connects the input and output pads of the semiconductor chip with the bond fingers of the circuit board. The encapsulation material covers the semiconductor, the electric connection means and a portion of the circuit board. The conductive balls are fusion-welded on the ball lands of the circuit board.

Semiconductor package and method for manufacturing the same

Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.

Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same

A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can improve an electrical conductivity of the conductive paste.

Conductive paste and printed circuit board using the same

The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics.

Conductive paste including a carbon nanotube and printed circuit board using the same

A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.

Mounting substrate and manufacturing method thereof

Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the passive chip is mounted in the blind hole.

Chang-Sup Ryu

Papers

Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same

Conductive paste and printed circuit board using the same

Conductive paste including a carbon nanotube and printed circuit board using the same

Mounting substrate and manufacturing method thereof

Method of fabricating PCB including embedded passive chip