Patent
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
TLDR
In this paper, a dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectoric constant corresponding to the capacitance of a decoupling chip capacitor.Abstract:
Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.read more
Citations
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Patent
Circuitry component and method for forming the same
TL;DR: The first and second metallic posts have a height between 20 and 300 microns, with the ratio of the maximum horizontal dimension to the height of the second bump being less than 4 as mentioned in this paper.
Patent
Post passivation structure for a semiconductor device and packaging process for same
TL;DR: In this paper, a post passivation rerouting support structure comprises a relatively thin support layer above the passivation layer to support the RDL, and a relatively thick support layer for fine pitch interconnects.
Patent
Solid Electrolytic Capacitor with Facedown Terminations
TL;DR: In this article, a solid electrolytic capacitor that contains an anode lead that is electrically connected to the anode body by a refractory metal paste (e.g., tantalum paste) is presented.
Patent
Wiring board with built-in capacitor
TL;DR: In this paper, a multilayer wiring board with built-in capacitors is presented, which is capable of mounting an IC chip on the board and capable of grounding the IC chip.
Patent
Printed circuit board including embedded capacitor and method of fabricating same
TL;DR: In this article, a PCB including an embedded capacitor and a method of fabricating the same is described, where the long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.
References
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Patent
Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
James R. Howard,Gregory L. Lucas +1 more
TL;DR: In this article, a capacitor laminate is described as an intermediate product for use in a capacitive printed circuit board or as part of the assembled printed circuit boards in order to provide a bypass capacitive function for large numbers of devices mounted or formed on the printed circuits board, the capacitance being dependent upon random firing or operation of the devices.
Patent
Electronic package having embedded capacitors and method of fabrication therefor
TL;DR: In this paper, the capacitors are mounted to a package layer, and a nonconductive layer is applied over the capacitance terminals, and when the build-up process is completed, the capacitor terminals are electrically connected to the top surface of the package.
Patent
In situ method for forming a capacitive PCB
TL;DR: An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foam to the sheet simultaneously as the PCB is formed by a final lamination step is described in this paper.
Patent
Printed circuit board having an integrated decoupling capacitive element
TL;DR: In this article, a printed circuit board is disclosed which includes a high capacitance power distribution core, the manufacture of which is compatible with standard printed circuit boards assembly technology, and the resulting capacitance is typically sufficient to totally eliminate the need for decoupling capacitors on a typical printed circuit.
Patent
Individual, embedded capacitors for laminated printed circuit boards
TL;DR: In this article, a method of fabricating individual embedded capacitors in multilayer printed circuit boards is described, based on a sequential build-up technology employing a first patternable insulator.
Related Papers (5)
Structure Of Embedded Capacitors And Fabrication Method Thereof
Wei-Chun Yang,Chien-Wei Chang +1 more