A substrate cleaning chamber (24) comprises various components, such as for example, a consumable ceramic liner (10), substrate heating pedestal (80), and process kit (114). The consumable ceramic liner (60) is provided for connecting a gas outlet channel (62) of a remote gas energizer (52) to a gas inlet channel (40) of a substrate cleaning chamber (24). The substrate heating pedestal (80) comprises an annular plate (82) having a substrate receiving surface (84) with a plurality of ceramic balls (90) positioned in an array of recesses (88). A process kit (114) comprises a top plate (116), top liner(118), gas distributor plate (120), bottom liner (122), and focus ring (124).

Substrate cleaning chamber and components

An atomic layer deposition chamber comprises a gas distributor comprising a central cap having a conical passageway between a gas inlet and gas outlet. The gas distributor also has a ceiling plate comprising first and second conical apertures that are connected. The first conical aperture receives a process gas from the gas outlet of the central cap. The second conical aperture extends radially outwardly from the first conical aperture. The gas distributor also has a peripheral ledge that rests on a sidewall of the chamber.

Atomic layer deposition chamber and components

A process kit comprises a ring assembly that is placed about a substrate support in a substrate processing chamber to reduce deposition of process deposits on the chamber components and on an overhang edge of the substrate. The process kit includes a deposition ring, cover ring, and anti-lift bracket, and can also include a unitary shield. A target is also described.

Process kit and target for substrate processing chamber

A method and system to measure misalignment error between two overlying or interlaced periodic structures are proposed. The overlying or interlaced periodic structures are illuminated by incident radiation, and the diffracted radiation of the incident radiation by the overlying or interlaced periodic structures are detected to provide an output signal. The misalignment between the overlying or interlaced periodic structures may then be determined from the output signal.

Periodic patterns and technique to control misalignment between two layers

A window assembly comprises a plurality of dynamic electrochromic zones formed on a single transparent substrate in which at least two electrochromic zones are independently controllable. In one exemplary embodiment, the window assembly comprises an Insulated Glass Unit (IGU), and at least one transparent substrate comprises a lite. In another exemplary embodiment, the IGU comprises at least two lites in which at least one lite comprises a plurality of independently controllable dynamic zones.

Multi-pane dynamic window and method for making same

A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.

Thermography test method and apparatus for bonding evaluation in sputtering targets

A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature by providing projections and grooves in the baching plate and the target and deforming the projections to at least partially fill the grooves. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.

Method of forming a sputtering target assembly and assembly made therefrom

A method of forming a sputtering target assembly and other metal articles is described. Sputtering target assemblies and metal articles are also described. The method includes bonding a sputter target to a backing plate using resistance heating or welding to bond assembly members that respectively include mating projections and grooves formed in bonding surfaces thereof.

Sputtering target assemblies using resistance welding

A process is described for processing metal which includes clock rolling a metal plate until the desired thickness is achieved to form a rolled plate. Sputtering targets and other metal articles are further described.

Charles E. Wickersham

Papers

Thermography test method and apparatus for bonding evaluation in sputtering targets

Method of forming a sputtering target assembly and assembly made therefrom

Sputtering target assemblies using resistance welding

Tantalum sputtering target and method of fabrication

Sputtering target and method of fabrication