The present invention relates to a display device and, more particularly, to a transfer head for a semiconductor light-emitting device applied to the display device and a method for transferring a semiconductor light-emitting device. The transfer head for a semiconductor light-emitting device, according to the present invention, comprises: a base substrate; and an electrode unit disposed on the base substrate to generate an electrostatic force by charging an un-doped semiconductor layer of the semiconductor light-emitting device with electric charges, wherein the base substrate and the electrode unit are formed of light-transmitting materials so that at least a part of the semiconductor light-emitting device is viewable through the base substrate and the electrode unit in sequence.

Transfer head and transfer system for semiconductor light-emitting device and method for transferring semiconductor light-emitting device

The present invention generally relates to a laser processing systems for thermally processing substrates. The laser processing systems include a shield disposed between an energy source of the laser processing system and a substrate which is to be thermally processed. The shield includes an optically transparent window disposed adjacent to a cavity within the shield. The optically transparent window allows annealing energy to pass therethrough and to illuminate the substrate. The shield also includes one or more gas inlets and one or more gas outlets for introducing and removing a purge gas from the cavity within the shield. The purge gas is utilized to remove volatized or ablated components during thermal processing, and to provide a gas of predetermined composition, such as oxygen-free, to the thermally processed area.

Particle control in laser processing systems

The invention discloses a laser energy dynamic distribution model-based ablation depth solving method, belongs to the field of non-traditional machining, and relates to a laser maximum ablation depthsolving method based on a part surface energy dynamic distribution model during pulse laser machining. The method comprises the steps of firstly performing integration on energy distribution in a laser feeding direction according to an energy distribution equation of Gaussian pulse laser on a girdling plane, thereby obtaining an energy distribution equation of single pulse laser in a vertical feeding direction; according to geometric features of to-be-machined parts and laser machining process parameters, determining a geometric change law of a laser spot moving track and a discrete distribution feature of pulse laser, and obtaining the part surface energy dynamic distribution model during the pulse laser machining; and according to a laser ablation thermal energy balance law, giving out the laser maximum ablation depth solving method based on the part surface pulse laser energy dynamic distribution model. The method effectively solves the difficult problem of handling of a pulse laserdiscrete spot energy distribution problem, and is accurate in solving and easy in operation.

Laser energy dynamic distribution model-based ablation depth solving method

The invention relates to an assistant facility for a cutting machine, in particular to a rotary assistant device for cutting an around pipe and a square pipe. The rotary assistant device comprises a rack and is characterized in that a guide rail is arranged on the rack; one end of the guide rail is provided with a rotary bearing; a plurality of assistant locking claws are arranged on the rotary bearing; the other end of the guide rail is provided with a support seat; the lower end of the support seat is provided with a slider capable of sliding on the guide rail; a bearing seat and a servomotor are arranged on the support seat; one rotary shaft is positioned in the bearing seat; a chuck base is connected with the inner end of the rotary shaft; the chuck base is provided with a chuck; the outer end of the rotary shaft is connected with a rotary gear; the rotary gear is in transmission connection with a servomotor; the slider is provided with a gear rack; the rack is provided with a second servomotor; the gear rack is meshed with the output end of the second servomotor. The rotary assistant device for cutting the round pipe and the square pipe is simple in structure, convenient to use and suitable for different pipe diameters, the firmness of a cutting area is kept, the residual material after cutting is less and the cutting cost is reduced.

Rotary assistant device for cutting round pipe and square pipe

A method of manufacturing a display apparatus includes forming a plurality of display units including bending areas on a mother substrate. Each of the plurality of display units include a bending area configured to be bent about a bending axis. A protection film is attached to a lower surface of the mother substrate. The protection film includes a protection film base and an adhesive layer. An opening or a groove is formed corresponding to the bending area of each of the plurality of display units by removing at least a portion of the protection film. The mother substrate and the protection film are cut to separate the plurality of display units from each other. The mother substrate is bent about the bending axis. The removing of the at least a portion of the protection film is performed by a laser beam.

Method of manufacturing a display apparatus including a bending area

According to an aspect of the present invention, a tip machining apparatus comprises: a jig gripping a machining tip; a laser irradiation part irradiating a laser to the machining tip; a transfer stage transferring the jig in a first direction, a second direction intersecting with the first direction, and a third direction intersecting with the first and the second direction; a first rotation member rotating the jig on a central axis parallel to the first direction; a second rotation member rotating the jig on a central axis parallel to the second direction; and a third rotation member rotating the jig on a central axis parallel to the third direction, wherein the laser irradiation part can form a pattern on the clearance surface of the tip.

Tip machining appratus, tip and muluty pattern forming method using the tip

Nozzle device for laser beam machining

The purpose of the present invention is to provide a laser processing method for controlling a depth of a thin film using beam-shaping and pulse frequency adjustment The present invention selectively removes foreign substances in a single thin film or a multi-layer thin film having similar physical properties or precisely controls a processing depth The present invention relates to the laser processing method using a laser processing device (10) processing by irradiating a pulse laser to an object (50) to be processed The present invention comprises: a unit processing step; and a depth control step of processing while controlling the processing depth

Laser machining method for film depth control using beam-shaping and pulse-count adjusting

The objective of the present invention is to provide a three-dimensional high-speed precise laser machining system, wherein a machining laser has a flat-top beam profile and enables high-speed and super-precise processing. More specifically, the objective of the present invention is to provide a three-dimensional high-speed precise laser machining apparatus, performing beam-shaping with the flat-top beam while combining super-precise processing, the advantage of object lens, with high-speed processing, the advantage of a scanner, and moving a focus location in the z-axis direction at high speed so as to realize the three-dimensional machining.

3 Multi modal laser machining system

A rod machining device using laser according to one embodiment of the present invention comprises a conveying stage to convey a rod-shaped workpiece; a laser irradiating part to irradiate laser to the workpiece; a first jig to fix the first longitudinal end of the workpiece; a second jig to fix the second longitudinal jig of the workpiece; and a tension forming part on the conveying stage to move the second jig in the longitudinal direction of the work piece.

Cho Sung Hak

Papers

Tip machining appratus, tip and muluty pattern forming method using the tip

Nozzle device for laser beam machining

Laser machining method for film depth control using beam-shaping and pulse-count adjusting

3 Multi modal laser machining system

Rod machining appratus using laser and rod machining method using laser