The invention discloses a laser energy dynamic distribution model-based ablation depth solving method, belongs to the field of non-traditional machining, and relates to a laser maximum ablation depthsolving method based on a part surface energy dynamic distribution model during pulse laser machining. The method comprises the steps of firstly performing integration on energy distribution in a laser feeding direction according to an energy distribution equation of Gaussian pulse laser on a girdling plane, thereby obtaining an energy distribution equation of single pulse laser in a vertical feeding direction; according to geometric features of to-be-machined parts and laser machining process parameters, determining a geometric change law of a laser spot moving track and a discrete distribution feature of pulse laser, and obtaining the part surface energy dynamic distribution model during the pulse laser machining; and according to a laser ablation thermal energy balance law, giving out the laser maximum ablation depth solving method based on the part surface pulse laser energy dynamic distribution model. The method effectively solves the difficult problem of handling of a pulse laserdiscrete spot energy distribution problem, and is accurate in solving and easy in operation.

Laser energy dynamic distribution model-based ablation depth solving method

A method of manufacturing a display apparatus includes forming a plurality of display units including bending areas on a mother substrate. Each of the plurality of display units include a bending area configured to be bent about a bending axis. A protection film is attached to a lower surface of the mother substrate. The protection film includes a protection film base and an adhesive layer. An opening or a groove is formed corresponding to the bending area of each of the plurality of display units by removing at least a portion of the protection film. The mother substrate and the protection film are cut to separate the plurality of display units from each other. The mother substrate is bent about the bending axis. The removing of the at least a portion of the protection film is performed by a laser beam.

Method of manufacturing a display apparatus including a bending area

An imaging system that includes a digital micromirror device (DMD) and a tunable filter, wherein the imagining system applicable for Raman imaging, can fluorescent imaging, phosphorescent imaging, photoluminescent imaging, all of which require excitation of a specimen at a particular wavelength and analyzing the reflected light from the specimen at a wavelength that is different from the excitation wavelength, so called inelastic light scattering - ILS. A reconfigurable DMD-based inverse, spatially offset Raman spectroscopy (SORS) system is also described. Beneficially, the DMD system in the excitation path provides a uniform intensity over the sample field of view. It is also configured to prevent sample damage. Placement of a second DMD in the return path of light enables selective rejection of light in space to obtain a reconfigurable inverse SORS system that enables collection of information from different layer depths of the sample using a single detector.

Digital micromirror device and kinematically tunable wavelength filter-based imaging systems

The invention relates to a device for preparing a high-quality high-depth-diameter-ratio micro hole by using a light ray obtained through femtosecond laser time domain/space shaping, and belongs to the field of transparent material micro-machining. According to the technical scheme, pulse time domain shaping equipment is used for generating a femtosecond laser pulse sequence; the position of a to-be-machined sample is adjusted to enable the light rays to generate micro holes with the maximum depths in the sample; the neutron pulse time delay of the pulse sequence is optimized so as to improvethe micro hole quality; a half-wave plate and a polarizing plate are combined for use to adjust the energy of lasers focused by two lenses correspondingly so as to enable the diameters of the micro holes formed by the lasers after being focused by the two lenses in the to-be-machined sample to be equal; the two focusing lenses are adjusted to enable the two independent light rays to be collinear in space and to be overlapped in an end-to-end mode to form an extended uniform light ray; and the position of the sample is moved to enable the light ray which is overlapped in the end-to-end mode togenerate a micro hole with the maximum depth-diameter ratio on the sample. According to the device, the quality and the depth-diameter ratio of the machined micro hole can be remarkably improved, themicro hole diameter adjusting range is wide, the machining environment is free of special requirements, the machining efficiency is high, and the machining cost is low.

Device for preparing high-quality high-depth-diameter-ratio micro hole by using light ray obtained through femtosecond laser time domain/space shaping

The invention belongs to the field of laser cutting, and in particular, relates to a device and a method for laser cutting of low-temperature cofired ceramic. The device comprises a laser, a beam expander, a double-rail optical diffraction element, a scanning galvanometer, a telecentric lens, and an X-Y motion carrying table for fixing workpieces to be cut, wherein the laser emits a first light beam; the first light beam is collimated by the beam expander to reach the double-rail optical diffraction element; the double-rail optical diffraction element converts the incident first light beam into two second light beams with consistent distribution of light spot energy for emission to reach the scanning galvanometer; and after the directions of the second light beams are adjusted by the scanning galvanometer, the second light beams are focused by the telecentric lens to the surfaces of workpieces to be cut (low-temperature cofired ceramic). After the double-rail optical diffraction element converts the first light beam into two second light beams with consistent distribution of the light spot energy, the low-temperature cofired ceramic is cut, so that the cutting speed and the cuttingquality can be effectively improved, and the working efficiency is improved.

Device and method for laser cutting of low-temperature cofired ceramic

The purpose of the present invention is to provide a laser processing method for controlling a depth of a thin film using beam-shaping and pulse frequency adjustment The present invention selectively removes foreign substances in a single thin film or a multi-layer thin film having similar physical properties or precisely controls a processing depth The present invention relates to the laser processing method using a laser processing device (10) processing by irradiating a pulse laser to an object (50) to be processed The present invention comprises: a unit processing step; and a depth control step of processing while controlling the processing depth

Laser machining method for film depth control using beam-shaping and pulse-count adjusting

The objective of the present invention is to provide a three-dimensional high-speed precise laser machining system, wherein a machining laser has a flat-top beam profile and enables high-speed and super-precise processing. More specifically, the objective of the present invention is to provide a three-dimensional high-speed precise laser machining apparatus, performing beam-shaping with the flat-top beam while combining super-precise processing, the advantage of object lens, with high-speed processing, the advantage of a scanner, and moving a focus location in the z-axis direction at high speed so as to realize the three-dimensional machining.

3 Multi modal laser machining system

The present invention aims to provide a Bessel beam laser machining apparatus for a high aspect ratio hole, which allows a micro-shape having a high aspect ratio to be processed with high degree of accuracy by performing laser machining using a Bessel beam. The other aim of the present invention is to provide the Bessel beam laser machining apparatus for processing a high aspect ratio hole, which is economical and excellently compatible with an existing apparatus by allowing only a simple optical system to be the necessary composition to perform high aspect ratio machining.

Bessel beam laser machining apparatus for high aspect rate hole

The present invention relates to a Bessel beam laser processing technique using an axicon lens, and more particularly, to an axicon lens having multiple angles for enhancing processing efficiency of a Bessel beam laser for reducing energy loss during laser processing using an axicon lens when laser processing by compressing focus depth in a direction of an optical axis to draw light into a point where light passing through an edge portion of the lens.

Multi-Angle Axicon Lens for Increased Laser Processing Efficiency of Bessel Beam

The present invention relates to free formation machining ultrafast laser equipment and, more specifically, relates to free formation machining ultrafast laser equipment which can prevent a diffraction phenomenon of a beam while changing the shape of the beam to various shapes which a user desires, and further, check characteristics of an object to be processed with respect to the beam forming the object to be processed and a changed processing shape of the object to be processed in real time while processing the object to be processed.

Kim Hun Young

Papers

Laser machining method for film depth control using beam-shaping and pulse-count adjusting

3 Multi modal laser machining system

Bessel beam laser machining apparatus for high aspect rate hole

Multi-Angle Axicon Lens for Increased Laser Processing Efficiency of Bessel Beam

Free Formation machining Ultrafast laser Equipment