C
Chris R. McGuirk
Researcher at Applied Materials
Publications - 11
Citations - 373
Chris R. McGuirk is an academic researcher from Applied Materials. The author has contributed to research in topics: Layer (electronics) & Barrier layer. The author has an hindex of 7, co-authored 11 publications receiving 373 citations.
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Patent
Electroless deposition method
Deenesh Padhi,Joseph Yahalom,Sivakami Ramanathan,Chris R. McGuirk,Srinivas Gandikota,Girish Dixit +5 more
TL;DR: In this paper, a method for forming a metal or metal silicide layer by an electroless deposition technique is described, and a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface and depositing a conductive material on the initiation layer.
Patent
Electroless deposition method over sub-micron apertures
Srinivas Gandikota,Chris R. McGuirk,Deenesh Padhi,Muhammad Malik,Sivakami Ramanathan,Girish Dixit,Robin Cheung +6 more
TL;DR: In this paper, a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate is described.
Journal ArticleDOI
Electrodeposition of copper–tin alloy thin films for microelectronic applications
Deenesh Padhi,Srinivas Gandikota,Hoa B. Nguyen,Chris R. McGuirk,Sivakami Ramanathan,Joseph Yahalom,Girish Dixit +6 more
TL;DR: In this paper, the authors discuss a method to co-deposit an alloy of copper and tin in sub-microscopic features with high aspect ratio using a sulfate bath.
Patent
Method of depositing a catalytic layer
Srinivas Gandikota,Chris R. McGuirk,Deenesh Padhi,Muhammad Malik,Sivakami Ramanathan,Girish Dixit,Robin Cheung +6 more
TL;DR: In this paper, a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate is described.
Patent
Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
TL;DR: In this article, a method for void-free plating of a metal into high aspect ratio features is described. But the plating process is carried out in a plating solution containing metal at a molar concentration of between about 0.4 M and about 0.9 M, an acid at a concentration of about 4 mg/L and about 40 mg/l, a suppressor at a ratio of between 2 mL/L, and about 15 mL/l.