The phase-shifting mask consists of a normal transmission mask that has been coated with a transparent layer patterned to ensure that the optical phases of nearest apertures are opposite. Destructive interference between waves from adjacent apertures cancels some diffraction effects and increases the spatial resolution with which such patterns can be projected. A simple theory predicts a near doubling of resolution for illumination with partial incoherence σ < 0.3, and substantial improvements in resolution for σ < 0.7. Initial results obtained with a phase-shifting mask patterned with typical device structures by electron-beam lithography and exposed using a Mann 4800 10× tool reveals a 40-percent increase in usuable resolution with some structures printed at a resolution of 1000 lines/mm. Phase-shifting mask structures can be used to facilitate proximity printing with larger gaps between mask and wafer. Theory indicates that the increase in resolution is accompanied by a minimal decrease in depth of focus. Thus the phase-shifting mask may be the most desirable device for enhancing optical lithography resolution in the VLSI/VHSIC era.

Improving resolution in photolithography with a phase-shifting mask

A lithographic apparatus configured to project a patterned beam of radiation onto a target portion of a substrate is disclosed. The apparatus includes a first radiation dose detector and a second radiation dose detector, each detector comprising a secondary electron emission surface configured to receive a radiation flux and to emit secondary electrons due to the receipt of the radiation flux, the first radiation dose detector located upstream with respect to the second radiation dose detector viewed with respect to a direction of radiation transmission, and a meter, connected to each detector, to detect a current or voltage resulting from the secondary electron emission from the respective electron emission surface.

Lithographic apparatus, and device manufacturing method

A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

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Step and flash imprint lithography

An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength dependent and may include the intensity of TM- and TE-polarized radiation and their relative phase difference.

Method and apparatus for angular-resolved spectroscopic lithography characterization

The present invention is directed to methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. In one embodiment, the imprint process is designed to imprint only a portion of the substrate. The remainder of the substrate is imprinted by moving the template to a different portion of the template and repeating the imprint lithography process.

Step and repeat imprint lithography processes

A metrology apparatus for determining bias or overlay error in a substrate formed by a lithographic process includes an aperture between the objective lens and the image plane adapted to set the effective numerical aperture of the apparatus. The aperture is adjustable to vary the effective numerical aperture of the apparatus and the aperture may be non-circular, for example, rectangular, to individually vary the effective numerical aperture of the apparatus in horizontal and vertical directions. To determine bias or overlay error there is provided a target having an array of elements on a substrate, the array comprising a plurality of spaced, substantially parallel elements having a length and a width, the sum of the width of an element and the spacing of adjacent elements defining a pitch of the elements, edges of the elements being aligned along a line forming opposite array edges, the distance between array edges comprising the array width. The numerical aperture is adjusted such that the pitch of the elements is less than or approximately equal to the ratio of the wavelength of the light source to the numerical aperture value of the optical metrology tool in the direction of the array edges, and the edges of the array are resolved with the optical metrology tool and the width of the array are measured to determine bias or overlay error in the substrate. A camera may be adapted to create a digital image of a target and the components of the digital image in the direction of the pitch of the elements, normal to the length of the elements, may be suppressed to resolve the edges of the array and measure the width of the array. Preferably, the means for suppressing components of the digital image comprises a microprocessor adapted to perform a fast Fourier transform on the digital image to convert image intensity to a spatial frequency domain and a filter to suppress high spatial frequency components of the image in the direction of the pitch of the elements.

Optical metrology tool and method of using same

A method of determining bias or overlay error in a substrate formed by a lithographic process uses a pair of straight vernier arrays of parallel elements, a staggered vernier array of parallel elements, and optionally at least one image shortening array on the substrate. The ends of the elements form the array edges. The vernier arrays are overlaid such that: i) the elements of the straight and staggered arrays are substantially parallel; ii) one of the edges of the staggered array intersects with one of the edges of one the straight arrays; and iii) the other of the edges of the staggered array intersects with one of the edges of the other of the straight arrays. Bias or overlay error is determined by: i) locating the points of intersection of the edges of the second vernier array with the edges of the first vernier arrays and measuring the degree of separation of the intersection points, and ii) measuring the separation between adjacent edges of the image shortening array and the one of the first or second vernier arrays having corresponding element width and element spacing. Preferably, the location of the intersection points is measured relative to a fixed point on one of the arrays. Bias is proportional to the difference between the locations of the intersection points relative to a fixed point on one of the arrays. Overlay error is proportional to the sum of the locations of the intersection points relative to a fixed point on one of the arrays. A moire fringe pattern may be created by the degree of overlap of the straight and staggered arrays, and bias or overlay error may also be determined by measuring the fringe created in the moire fringe pattern.

Method of measuring bias and edge overlay error for sub-0.5 micron ground rules

A method for overlay metrology and control. Simultaneous use of between-field overlay metrology to control field term alignment error at all levels and level-to-level metrology to control field term, grid term, and translation alignment errors at all levels is applied.

Method for overlay control system

A method is described for measuring a dimension on a substrate, wherein a target pattern (455) is provided with a nominal characteristic dimension that repeats at a primary pitch of period P, and has a pre-determined variation orthogonal to the primary direction. The target pattern (455) formed on the substrate is then illuminated so that at least one non-zero diffracted order is detected. The response of the non-zero diffracted order to variation in the printed characteristic dimension relative to nominal is used to determine the dimension of interest, such as critical dimension or overlay, on the substrate. An apparatus (40) for performing the method of the present invention includes an illumination source (410), a detector (460) for detecting a non-zero diffracted order, and means for positioning the source (410) relative to the target (455) so that one or more non-zero diffracted orders from the target (455) are detected at the detector (460).

Differential critical dimension and overlay metrology apparatus and measurement method

A target for determining bias or overlay error in a substrate formed by a lithographic process uses a pair of straight vernier arrays of parallel elements, a staggered vernier array of parallel elements, and optionally at least one image shortening array on the substrate. The ends of the elements form the array edges. The vernier arrays are overlaid such that: i) the elements of the straight and staggered arrays are substantially parallel; ii) one of the edges of the staggered array intersects with one of the edges of one the straight arrays; and iii) the other of the edges of the staggered array intersects with one of the edges of the other of the straight arrays. Bias or overlay error is determined by: i) locating the points of intersection of the edges of the second vernier array with the edges of the first vernier arrays and measuring the degree of separation of the intersection points, and ii) measuring the separation between adjacent edges of the image shortening array and the one of the first or second vernier arrays having corresponding element width and element spacing. Preferably, the location of the intersection points is measured relative to a fixed point on one of the arrays. Bias is proportional to the difference between the locations of the intersection points relative to a fixed point on one of the arrays. Overlay error is proportional to the sum of the locations of the intersection points relative to a fixed point on one of the arrays. A moire fringe pattern may be created by the degree of overlap of the straight and staggered arrays, and bias or overlay error may also be determined by measuring the fringe created in the moire fringe pattern.

Christopher P. Ausschnitt

Papers

Optical metrology tool and method of using same

Method of measuring bias and edge overlay error for sub-0.5 micron ground rules

Method for overlay control system

Differential critical dimension and overlay metrology apparatus and measurement method

Edge overlay measurement target for sub-0.5 micron ground rules