C
Collin S. Meierbachtol
Researcher at Los Alamos National Laboratory
Publications - 18
Citations - 155
Collin S. Meierbachtol is an academic researcher from Los Alamos National Laboratory. The author has contributed to research in topics: Terahertz radiation & Plasmon. The author has an hindex of 6, co-authored 17 publications receiving 122 citations. Previous affiliations of Collin S. Meierbachtol include Air Force Research Laboratory & Michigan State University.
Papers
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Journal ArticleDOI
Conformal Electromagnetic Particle in Cell: A Review
TL;DR: In this article, a chronological history of relevant particle physics algorithms often employed in these conformal simulations is presented, along with a brief summary of major time-dependent electromagnetic solution methods.
Journal ArticleDOI
Specification of the near-Earth space environment with SHIELDS
Vania K. Jordanova,Gian Luca Delzanno,Michael G. Henderson,Humberto C. Godinez,Christopher A. Jeffery,Earl Lawrence,Steven K. Morley,John David Moulton,Louis J. Vernon,J. R. Woodroffe,Thiago Brito,M. Engel,Collin S. Meierbachtol,Daniil Svyatsky,Yiqun Yu,Gabor Toth,Daniel T. Welling,Yuxi Chen,J. D. Haiducek,Stefano Markidis,Jay M. Albert,Joachim Birn,Joachim Birn,Michael H. Denton,Michael H. Denton,Richard B. Horne +25 more
TL;DR: The SHIELDS framework as discussed by the authors was developed to understand the dynamics of the surface charging environment (SCE), the hot (keV) electrons representing the source and seed populations for the radiation belts, on both macro-and micro-scale.
Journal ArticleDOI
An electrostatic Particle-In-Cell code on multi-block structured meshes
TL;DR: Compared to PIC codes on unstructured meshes, which have also been used for their flexibility in handling complex geometries but whose performance suffers from issues associated with data locality and indirect data access patterns, PIC code on multi-block structured meshes may offer the best compromise for capturing complexGeometries while also maintaining solution accuracy and computational efficiency.
Proceedings ArticleDOI
Metamaterial-inspired absorbers for Terahertz packaging applications
TL;DR: In this article, a low-index, low-loss dielectric sandwiched between a patterned, two-dimensionally periodic, thin metallic layer and a metal backing was used for wide-band absorption of stray signals for THz packages.
Proceedings ArticleDOI
Surface plasmon-assisted terahertz imaging array
TL;DR: In this article, a spoof surface plasmon assisted antenna is paired with a metamaterial enhanced bolometer structure in the formation of a THz focal plane array pixel, which shows high sensitivity at the desired operating frequency.