Micromachining technology opens up many new opportunities for optical and optoelectronic systems It offers unprecedented capabilities in extending the functionality of optical devices and the miniaturization of optical systems Movable structures, microactuators, and microoptical elements can be monolithically integrated on the same substrate using batch processing technologies In this paper, we review the recent advances in this fast-emerging field The basic bulk- and surface-micromachining technologies applicable to optical systems are reviewed The free-space microoptical bench and the concept of optical prealignment are introduced Examples of micromachined optical devices are described, including optical switches with low loss and high contract ratio, low-cost modulators, micromechanical scanners, and the XYZ micropositioners with large travel distance and fine positioning accuracy Monolithically integrated systems such as single-chip optical disk pickup heads and a femtosecond autocorrelator have also been demonstrated

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Micromachining for optical and optoelectronic systems

An integrated micro-electromechanical (MEM) optical resonator comprises a cantilever beam which is fixed to a substrate at one end and extends freely over the substrate at the other end, and a bimorph actuator stacked atop the beam at its fixed end. A reflective surface partially covers the top of the beam at its free end. The bimorph actuator comprises material layers having different thermal expansion coefficients. A DC-biased AC voltage connected across the actuator causes it to heat and cool as the current passing through it increases and decreases, creating a thermal bimorph effect which causes the cantilever beam and the reflective surface to oscillate in accordance with the varying current, preferably at the beam and actuator structure's fundamental resonant frequency. Combining the resonator with a light source and actuator excitation circuitry creates an optical scanner engine which delivers a scan angle in excess of 20 degrees and a scan rate of up to 2000 Hz, using a driving voltage of only 2 Vp-p.

Micro-electromechanical (MEM) optical resonator and method

A MEMS (Micro Electro Mechanical System) variable optical attenuator is provided that is capable of optical attenuation over a full range of optical power. The MEMS variable optical attenuator comprises a microelectronic substrate, a MEMS actuator and an optical shutter. The MEMS variable optical attenuator may also comprise a clamping element capable of locking the optical shutter at a desired attenuation position. The variable light attenuator is capable of attenuating optical beams that have their optical axis running parallel and perpendicular to the substrate. Additionally, the MEMS actuator of the present invention may comprise an array of MEMS actuators capable of supplying the optical shutter with greater displacement distances and, thus a fuller range of optical attenuation. In one embodiment of the invention, the MEMS actuator comprises a thermal arched beam actuator. Additionally, the variable optical attenuator of the present invention may be embodied in a thermal bimorph cantilever structure. This alternate embodiment includes a microelectronic substrate and a thermal bimorph cantilever structure having at least two materials of different thermal coefficient of expansion. The thermal bimorph is responsive to thermal activation and moves in the direction of the material having the lower thermal coefficient expansion. Upon activation, the thermal bimorph intercepts the path of the optical beam and provides for the desired level of optical attenuation. The invention also provides for a method of optical attenuation and a method for fabricating an optical attenuator in accordance with the described structures.

Mems variable optical attenuator

A monolithic silicon integrated optical micro-scanner is presented. The device consists of a mirror located on the tip of a thermal bimorph actuator beam. The fabrication process is very simple and compatible with IC fabrication techniques. The device is excited electrothermally at its resonance frequency, enabling large angular deflections at low power consumption. The technological process consists of basic frontside silicon micromachining steps requiring only three mask levels. The moving part is defined by selective silicon bulk etching. The bimorph beam is made of silicon dioxide and a thin film conductor. The residual stress in the two layers is used to achieve a 45 degrees out-of-plane rest position of the mirror. This allows optical components (e.g., laser diode, collimating lens) to be placed directly on the silicon substrate. Mirrors of 500 x 300 to 800 x 800 mu m(2) with resonant frequencies varying from 600 to 100 Hz were realized. Mechanical scan angles of above 90 degrees were achieved. The devices are very robust and have run through fatigue tests of billions of cycles at 300 Hz and 90 degrees deflection. The power consumption of the device is typically 1 mW for 30 degrees mirror deflection. (C) 1999 Elsevier Science S.A. All rights reserved.

Thermally actuated optical microscanner with large angle and low consumption

Early cancer detection has been playing an important role in reducing cancer mortality. Optical coherence tomography (OCT), due to its micron-scale resolution, has the ability to detect cancerous tissues at their early stages. For internal organs, endoscopic probes are needed as the penetration depth of OCT is about 1–3 mm. MEMS technology has the advantages of fast speed, small size, and low cost, and it has been widely used as the scanning engine in endoscopic OCT probes. Research results have shown great potential for OCT in endoscopic imaging by incorporating MEMS scanning mirrors. Various MEMS-OCT designs are introduced, and their imaging results are reviewed in the paper.

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MEMS-Based Endoscopic Optical Coherence Tomography

Rockwell is working on the development of a micro-electromechanical optical scanner based on bimorph microactuators. This scanner is lightweight, is small, and has superior scanning performance. The scanner is a low-power (<1 W) device that has large scan angles (?20 deg) and scan rates in the range of 100 to 2000 Hz. It works for all wavelengths and offers the potential for monolithic integration with both electronics and optics for on-chip signal processing and control. The optical scanner consists of two main components—actuator and mirror— which are fabricated on a silicon cantilever beam. The actuator is comprised of a bimorph layer covered with two metal layers, which function as top and bottom electrodes. The mirror can be as large as 12 mm2 in area, is placed at the end of the cantilever beam, and is designed for maximum optical flatness. The optical efficiency of the device is very high and can exceed 90% on proper metallization of the mirror area. The scan angle is a function of beam thickness, power efficiency of the bimorph, and many other design criteria. Through many improvements in these design parameters, a scan angle greater than 20 deg is expected to be achieved with high yield.

Curtis F. Sell

Papers

Development of micro-electro-mechanical optical scanner