A novel design technique is proposed for storage elements which are insensitive to radiation-induced single-event upsets. This technique is suitable for implementation in high density ASICs and static RAMs using submicron CMOS technology.

Upset hardened memory design for submicron CMOS technology

Physical mechanisms responsible for nondestructive single-event effects in digital microelectronics are reviewed, concentrating on silicon MOS devices and integrated circuits. A brief historical overview of single-event effects in space and terrestrial systems is given, and upset mechanisms in dynamic random access memories, static random access memories, and combinational logic are detailed. Techniques for mitigating single-event upset are described, as well as methods for predicting device and circuit single-event response using computer simulations. The impact of technology trends on single-event susceptibility and future areas of concern are explored.

Basic mechanisms and modeling of single-event upset in digital microelectronics

A gate-level radiation hardening technique for cost-effective reduction of the soft error failure rate in combinational logic circuits is described. The key idea is to exploit the asymmetric logical masking probabilities of gates, hardening gates that have the lowest logical masking probability to achieve cost-effective tradeoffs between overhead and soft error failure rate reduction. The asymmetry in the logical masking probabilities at a gate is leveraged by decoupling the physical from the logical (Boolean) aspects of soft error susceptibility of the gate. Gates are hardened to single-event upsets (SEUs) with specified worst case characteristics in increasing order of their logical masking probability, thereby maximizing the reduction in the soft error failure rate for specified overhead costs (area, power, and delay). Gate sizing for radiation hardening uses a novel gate (transistor) sizing technique that is both efficient and accurate. A full set of experimental results for process technologies ranging from 180 to 70 nm demonstrates the cost-effective tradeoffs that can be achieved. On average, the proposed technique has a radiation hardening overhead of 38.3%, 27.1%, and 3.8% in area, power, and delay for worst case SEUs across the four process technologies.

http://www.pitt.edu/~kmram/publications/tcad06.pdf

Gate sizing to radiation harden combinational logic

Total ionizing dose radiation effects on the electrical properties of metal-oxide-semiconductor devices and integrated circuits are complex in nature and have changed much during decades of device evolution. These effects are caused by radiation-induced charge buildup in oxide and interfacial regions. This paper presents an overview of these radiation-induced effects, their dependencies, and the many different approaches to their mitigation.

Radiation effects and hardening of MOS technology: devices and circuits

This paper presents an overview of a comprehensive collection of on-line testing techniques for VLSI. Such techniques are for instance: self-checking design, allowing high quality concurrent checking by means of hardware cost drastically lower than duplication; signature monitoring, allowing low cost concurrent error detection for FSMs; on-line monitoring of reliability relevant parameters such as current, temperature, abnormal delay, signal activity during steady state, radiation dose, clock waveforms, etc.; exploitation of standard BIST, or implementation of BIST techniques specific to on-line testing (Transparent BIST, Built-In Concurrent Self-Test,...); exploitation of scan paths to transfer internal states for performing various tasks for on-line testing or fault tolerance; fail-safe techniques for VLSI, avoiding complex fail-safe interfaces using discrete components; radiation hardened designs, avoiding expensive fabrication process such as SOI, etc.

On-Line Testing for VLSI—A Compendium of Approaches

Several technologies, including bulk and epi CMOS, CMOS/SOI-SOS (silicon-on-insulator-silicon-on-sapphire), CML (current-mode logic), ECL (emitter-coupled logic), analog bipolar (JI, single-poly DI, and SOI) and GaAs E/D (enhancement/depletion) heterojunction MESFET, are discussed. The discussion includes the direct effects of space radiation on microelectronic materials and devices, how these effects are evidenced in circuit and device design parameter variations, the particular effects of most significance to each functional class of circuit, specific techniques for hardening high-speed circuits, design examples for integrated systems, including operational amplifiers and A/D (analog/digital) converters, and the computer simulation of radiation effects on microelectronic ICs. >

D.F. Berndt

Papers

The design of radiation-hardened ICs for space: a compendium of approaches