In the past several years, research in each of the wide‐band‐gap semiconductors, SiC, GaN, and ZnSe, has led to major advances which now make them viable for device applications. The merits of each contender for high‐temperature electronics and short‐wavelength optical applications are compared. The outstanding thermal and chemical stability of SiC and GaN should enable them to operate at high temperatures and in hostile environments, and also make them attractive for high‐power operation. The present advanced stage of development of SiC substrates and metal‐oxide‐semiconductor technology makes SiC the leading contender for high‐temperature and high‐power applications if ohmic contacts and interface‐state densities can be further improved. GaN, despite fundamentally superior electronic properties and better ohmic contact resistances, must overcome the lack of an ideal substrate material and a relatively advanced SiC infrastructure in order to compete in electronics applications. Prototype transistors have been fabricated from both SiC and GaN, and the microwave characteristics and high‐temperature performance of SiC transistors have been studied. For optical emitters and detectors, ZnSe, SiC, and GaN all have demonstrated operation in the green, blue, or ultraviolet (UV) spectra. Blue SiC light‐emitting diodes (LEDs) have been on the market for several years, joined recently by UV and blue GaN‐based LEDs. These products should find wide use in full color display and other technologies. Promising prototype UV photodetectors have been fabricated from both SiC and GaN. In laser development, ZnSe leads the way with more sophisticated designs having further improved performance being rapidly demonstrated. If the low damage threshold of ZnSe continues to limit practical laser applications, GaN appears poised to become the semiconductor of choice for short‐wavelength lasers in optical memory and other applications. For further development of these materials to be realized, doping densities (especially p type) and ohmic contact technologies have to be improved. Economies of scale need to be realized through the development of larger SiC substrates. Improved substrate materials, ideally GaN itself, need to be aggressively pursued to further develop the GaN‐based material system and enable the fabrication of lasers. ZnSe material quality is already outstanding and now researchers must focus their attention on addressing the short lifetimes of ZnSe‐based lasers to determine whether the material is sufficiently durable for practical laser applications. The problems related to these three wide‐band‐gap semiconductor systems have moved away from materials science toward the device arena, where their technological development can rapidly be brought to maturity.

Large‐band‐gap SiC, III‐V nitride, and II‐VI ZnSe‐based semiconductor device technologies

Measurements of the equivalent parallel conductance of metal-insulator-semiconductor (MIS) capacitors are shown to give more detailed and accurate information about interface states than capacitance measurements. Experimental techniques and methods of analysis are described. From the results of the conductance technique, a realistic characterization of the Si–SiO 2 interface is developed. Salient features are: A continuum of states is found across the band gap of the silicon. Capture cross sections for holes and electrons are independent of energy over large portions of the band gap. The surface potential is subject to statistical fluctuations arising from various sources. The dominant contribution in the samples measured arises from a random distribution of surface charge. The fluctuating surface potential causes a dispersion of interface state time constants in the depletion region. In the weak inversion region the dispersion is eliminated by interaction between interface states and the minority carrier band. A single time constant results. From the experimentally established facts, equivalent circuits accurately describing the measurements are constructed.

The si-sio, interface – electrical properties as determined by the metal-insulator-silicon conductance technique

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

A new and accurate approach to charge-pumping measurements for the determination of the Si-SiO 2 interface state density directly on MOS transistors is presented. By a careful analysis of the different processes of emission of electrons towards the conduction band and of holes towards the valence band, depending on the charge state of the interface, all the previously ill-understood phenomena can be explained and the deviations from the simple charge-pumping theory can be accounted for. The presence of a geometric component in some transistor configurations is illustrated and the influence of trapping time constants is discussed. Furthermore, based on this insight, a new technique is developed for the determination of the energy distribution of interface states in small-area transistors, without requiring the knowledge of the surface potential dependence on gate voltage.

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A reliable approach to charge-pumping measurements in MOS transistors

Silicon carbide (SiC), a material long known with potential for high-temperature, high-power, high-frequency, and radiation hardened applications, has emerged as the most mature of the wide-bandgap (2.0 eV ≲ Eg ≲ 7.0 eV) semiconductors since the release of commercial 6HSiC bulk substrates in 1991 and 4HSiC substrates in 1994. Following a brief introduction to SiC material properties, the status of SiC in terms of bulk crystal growth, unit device fabrication processes, device performance, circuits and sensors is discussed. Emphasis is placed upon demonstrated high-temperature applications, such as power transistors and rectifiers, turbine engine combustion monitoring, temperature sensors, analog and digital circuitry, flame detectors, and accelerometers. While individual device performances have been impressive (e.g. 4HSiC MESFETs with fmax of 42 GHz and over 2.8 W mm−1 power density; 4HSiC static induction transistors with 225 W power output at 600 MHz, 47% power added efficiency (PAE), and 200 V forward blocking voltage), material defects in SiC, in particular micropipe defects, remain the primary impediment to wide-spread application in commercial markets. Micropipe defect densities have been reduced from near the 1000 cm−2 order of magnitude in 1992 to 3.5 cm−2 at the research level in 1995.

Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review

DENSITY OF SiO2–Si INTERFACE STATES

A solid state relay having a light-emitting diode, an array of series connected photodiodes and a field effect transistor is described

Solid state relay

The properties of silicon nitride, oxynitride, and oxide films formed by the pyrolysis of various mixtures of , , and are presented The variation in physical, optical, and electrical properties of this oxynitride series is examined The electrical and passivation properties of these films on Si are examined and compared with oxides These electrical data describe the general characteristics of nitride and oxynitride on top of Si and over thin (~300Aa) and thick (~1000Aa) thermal oxide films

https://iopscience.iop.org/article/10.1149/1.2411151/pdf

Properties of Si x O y N z Films on Si

Combustion in a gas turbine is controlled through use of flame spectroscopy in order to achieve low NO x emissions in the exhaust. By monitoring the combustion flame in the turbine to determine intensity of non-infrared spectral lines, and dynamically adjusting the fuel/air ratio of the fuel mixture such that this intensity remains below a predetermined level associated with a desired low level of NO x emissions, the engine produces significantly reduced NO x emissions in its exhaust but at a sufficiently high combustion flame temperature to avoid any undue risk of flame-out, thereby assuring stable, safe and reliable operation.

Combustion control for producing low NOx emissions through use of flame spectroscopy

The low‐temperature (77°K) MOS‐C (V) curves previously utilized to measure the number of fast interface states are analyzed. Quantitative variations in the number of fast states with variations in crystal orientation, oxidation atmosphere, vacuum and hydrogen annealing, together with some results of MOS‐FET vacuum annealing are presented. For instance, high‐temperature vacuum annealing of oxidized silicon wafers is shown to be capable of producing a very high density of donor and acceptor type fast interface state levels of the type previously identified by measuring MOS‐C (V) flatband voltage at low temperatures. These results suggest that these bands of donor and acceptor levels arise from a single type of defect which is electrically amphoteric.

Dale M. Brown

Papers

DENSITY OF SiO2–Si INTERFACE STATES

Solid state relay

Properties of Si x O y N z Films on Si

Combustion control for producing low NOx emissions through use of flame spectroscopy

Si ‐ SiO2 Fast Interface State Measurements