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David A. Jandzinski
Researcher at Motorola
Publications - 2
Citations - 211
David A. Jandzinski is an academic researcher from Motorola. The author has contributed to research in topics: Footprint (electronics) & Semiconductor package. The author has an hindex of 2, co-authored 2 publications receiving 211 citations.
Papers
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Patent
Electronic component and method of packaging
TL;DR: In this paper, a method of packaging an electronic component includes forming a hole (24) in a substrate (21) having a first surface (22) opposite a second surface (23) and disposing and patterning a malleable layer (26) over the first surface and over the hole of the substrate.
Patent
Three dimensional semiconductor package having flexible appendages
TL;DR: In this article, a three-dimensional folded module has been proposed to reduce the overall footprint for interconnecting multiple semiconductor die by an approximate factor of four when compared to conventional electronic packaging.