An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

A disclosed a gaming machine includes an input mechanism with a non-physical contact data interface. The non-physical contact data interface may be capable of reading loyalty program data from a loyalty program instrument without contact between the loyalty program instrument and the non-physical contact data interface. The input mechanism with the non-physical contact data interface may be one of a bill validator, a bar-code reader and a Radio Frequency Identification (RFID) tag reader. The loyalty program instrument may be a substrate including at least one of a 1-D bar-code printed on the substrate, a 2-D bar-code printed on the substrate, a symbol printed on the substrate, alpha-numeric character printed on the substrate, a RFID tag embedded in the substrate, a RFID tag printed on the substrate and combinations thereof. The loyalty program instrument may be used to store an index to a record in a database or a portable data file.

Flexible loyalty points programs

A method of making a stacked microelectronic assembly includes providing a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The method includes assembling a plurality of microelectronic elements to the attachment sites and electrically interconnecting the microelectronic elements and the leads. The flexible substrate is then folded so as to stack at least some of the microelectronic elements in substantially vertical alignment with one another to provide a stacked assembly with the conductive terminals exposed at the bottom end of the stack and the test contacts exposed at the top end of the stack.

Stacked microelectronic assembly and method therefor

A player tracking system for tracking customer activity for a casino establishment having gaming sections and non-gaming sections. The player tracking system includes a plurality of player tracking cards for distribution to respective participating customers that incorporate respective customer accounts associated with respective customer IDs. The system further includes a plurality of gaming activity player tracking units positioned in the gaming section of the casino establishment proximate the gaming activity which cooperates with the player tracking cards to monitor the gaming activity data of the respective customer, and a plurality of non-gaming activity player tracking units positioned in the non-gaming section of the casino establishment proximate the non-gaming activity which cooperates with the player tracking cards to monitor the non-gaming activity data of the respective customer. A computer system includes a database of the respective customer accounts associated with respective customer Ids, and each gaming activity player tracking unit and each non-gaming activity player tracking unit coupled to the computer system to process the respective gaming activity data and non-gaming activity data for each respective customer.

Player tracking assembly for complete patron tracking for both gaming and non-gaming casino activity

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant. A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

Plastic integrated circuit package and method and leadframe for making the package

A method of packaging an electronic component includes forming a hole (24) in a substrate (21) having a first surface (22) opposite a second surface (23) and disposing and patterning a malleable layer (26) over the first surface (22) and over the hole (24) of the substrate (21). The malleable layer (26) has a third surface (27) opposite a fourth surface (28). A portion (29) of the fourth surface (28) is exposed by the hole (24) in the substrate (21). An electrically conductive layer is simultaneously disposed over the portion (29) of the fourth surface (28) and over a different portion of the third surface (27) of the malleable layer (26). The malleable layer (26) is deformed into the hole (24). Then, a semiconductor die (43) is coupled to the malleable layer (26), and an underencapsulant (37) is disposed under the semiconductor die (43) and over the hole (24).

Electronic component and method of packaging

A three dimensional packaging approach reduces the overall footprint for interconnecting multiple semiconductor die. An three-dimensional folded module (10) produces a final package having a footprint size reduced by an approximate factor of four when compared to conventional electronic packaging. The module has a protective covering such as a cap (62) or a sealant (64) as a moisture barrier. Thus, high integration using flexible appendages (15, 25, 35, and 45) attached to a rigid substrate (12) and singularly folded above the substrate (12) results in both a small footprint package and also a light package. A reel-to-reel flex tape (56) assembly provides pre-tested flex boards (16, 26, 36, and 46) resulting in a cost-effective manufacturable package for semiconductor components.

Three dimensional semiconductor package having flexible appendages

A smartcard (10) is formed in part by a laminate layer (77). The laminate layer (77) is made up of a plurality of dielectric layers (11,30), insulating layers (45, 50), resistive layers (55), and electrically active structures. The electrically active structures include a capacitive structure (23) which is formed from one of the dielectric layers (11) and an antennae (32) which is made from a conductive layer that is formed into a spiral pattern on the another dielectric layer (30). These layers (11,30, 45, 50, 55) are formed separately and then pressed together to form the laminate layer (77).

Smartcard and method of making

A method for connecting substrates includes using an adhesive interposer structure (11) to bond a semiconductor device (26) to a substrate (18). The adhesive interposer structure (11) includes a non-conductive adhesive laminant (12) and conductive adhesive bumps (13). The conductive adhesive bumps (13) provide a conductive path between conductive bumps (27) on the semiconductor device (26) and conductive metal pads (21) located on the substrate (18). In an alternative embodiment, a conductive adhesive material (34) is screen or stencil printed into vias (39) located on a printed circuit board (38) to form conductive adhesive bumps (33). A non-conductive adhesive (52) is then screen or stencil printed onto the printed circuit board (38) adjacent the conductive adhesive bumps (33). A semiconductor die is then connected to the structure.

Method for coupling substrates and structure

A scanning laser ablation based via generation process for use in MCM-D (multichip module-D) substrate fabrication is described. The robustness of a variety of thin (1-5 mu m-thick) conformal metal masking layers was compared by static exposure with a computer-controlled XeCl excimer laser exposure tool. The relative ablation rates of commercially available dielectric materials were compared for a range of fluences from 0 to 600 mJ/cm/sup 2/ using static excimer laser exposure. Based on process limits established by these static test results, generic scanning laser ablation processing parameters were established which were successfully used for the fabrication of vias in low stress, acetylene terminated and fluorinated polyimides as well as benzocyclobutene (BCB) and polyphenylquinoxalines (PPQs). The extent of soot accumulation during scanning laser ablation was dependent on the conformal metal masking layer used. In some cases, excessive accumulation of soot resulted in mask cracking around the vias. The use of helium as a process gas was found to dramatically reduce the amount of soot that accumulated and consequently eliminated soot related mask damage. >

Theodore G. Tessier

Papers

Electronic component and method of packaging

Three dimensional semiconductor package having flexible appendages

Smartcard and method of making

Method for coupling substrates and structure

Compatibility of common MCM-D dielectrics with scanning laser ablation-via generation processes