The present invention is generally directed to improved microfluidic devices, systems and methods of using same, which incorporate channel profiles that impart significant benefits over previously described systems. In particular, the presently described devices and systems employ channels having, at least in part, depths that are varied over those which have been previously described. These varied channel depths provide numerous beneficial and unexpected results.

Microfluidic systems incorporating varied channel dimensions

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

Electroosmotic microchannel cooling system

A modular microfluidic system is described having at least one base board with a plurality of fluidly linked fluid supply apertures, optional intermediate level boards of equivalent construction, a plurality of microfluidic modules adapted to be detachably attached to the base board/ intermediate boards, each having one or more fluid inlets and/or outlets, and a plurality of fluid couplings preferably in the form of projecting ferrules to effect releasable fluid connection between a module and a base board/ intermediate level board via a supply aperture on the board and an inlet/outlet on the module. A method of providing a microfluidic system as a modular assembly is also described.

Modular microfluidic system

A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device

A method of and apparatus for regulating carbon dioxide using a pre-injection assembly coupled to a processing chamber operating at a supercritical state is disclosed. The method and apparatus utilize a source for providing supercritical carbon dioxide to the pre-injection assembly and a temperature control element for maintaining the pre-injection region at a supercritical temperature and pressure.

Phase change based heating element system and method

A modular microchannel heat exchanger for cooling a heated region and a method for making the device. A first section of the device features an array of thin copper sheets which are etched with rows of elongated holes that pierce the sheets, coated with silver and held together with the holes aligned. These holes form a microchannel having a desired aspect ratio. A second section of the device has a series of thin copper plates which are etched as apertures, coated with silver and stacked in a sequence on the sheets of the first section, the plate closest to the sheets having elongated apertures oriented transversely to the microchannel of the sheets, the apertures combining further from the sheets into circular apertures to fit a coaxial inlet and outlet conduit where unitary or pipe flow occurs. The inlet conduit is, through the branching series of plates, in communication with alternately spaced elongated apertures adjacent to the microchannel of the sheets, and the outlet conduit is in communication with the other alternate elongated apertures. A case for both sections has an inlet and outlet chamber with holes that the inlet and outlet conduits plug into.

Modular microchannel heat exchanger

Sophisticated packaging architectures have been developed that enable low cost, very high average power, long lived pumping of solid state lasers. Single water cooled manifolds now provide slab pumping of up to 2.5 kW of average optical power, while low cost yet flexible bar mounting techniques allow burn-in that enables very long lifetimes. Architecture modification allows for high peak power of up to 80 kW per water cooled pump manifold. Specialized high brightness packaging now allows approximately 20 watt cw bars to be lensed into less than 200 micrometers diameter spot sizes (approximately 54 kW/cm 2 ).

Advances in high average power long life laser diode pump array architectures

Methods of reformatting the output of laser diodes and maintaining much of their intrinsic brightness are discussed. A commercial, fiber-coupled package is shown with a symmetric etendue and a brightness of 15 kW/(cm2 sr). A symmeterized beam with a brightness of 200 kW/(cm2 sr) is demonstrated by using a combination of a micro-lensed diode array and a lens array.© (1994) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

David C. Mundinger

Papers

Modular microchannel heat exchanger

Advances in high average power long life laser diode pump array architectures

Ultrahigh-average-brightness semiconductor laser arrays