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David R. Otis
Researcher at Hewlett-Packard
Publications - 46
Citations - 921
David R. Otis is an academic researcher from Hewlett-Packard. The author has contributed to research in topics: Seal (mechanical) & Pulmonary surfactant. The author has an hindex of 16, co-authored 46 publications receiving 909 citations. Previous affiliations of David R. Otis include Massachusetts Institute of Technology & University of Minnesota.
Papers
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Journal ArticleDOI
Role of pulmonary surfactant in airway closure: a computational study
TL;DR: It is found that surfactant is effective in retarding or eliminating liquid bridging through the reduction of the mean surface tension and the action of surface tension gradients.
Journal ArticleDOI
Dynamic surface tension of surfactant TA: experiments and theory
TL;DR: A bubble surfactometer was used to measure the surface tension of an aqueous suspension of surfactant TA as a function of bubble area over a range of cycling rates and Surfactant bulk concentrations, and a model was developed to interpret and explain these data and for use in describing the dynamics of surface layers under more general circumstances.
Patent
Printhead warming method to defeat wait-time banding
David R. Otis,May Fong Ho +1 more
TL;DR: In this article, a thermal technique for reducing print density shifts due to print wait time in thermal ink jet printers is presented. But the technique is not suitable for the printing of large print sizes.
Patent
Self-sealing fluid interconnect with double sealing septum
TL;DR: In this paper, a fluid interconnect for coupling an ink supply to an ink-jet printer includes a fluid outlet and a fluid inlet, which can be coupled by pressing them together.
Journal ArticleDOI
Convective heat transfer response to height differences in an array of block-like electronic components
TL;DR: Etude experimentale du refroidissement par convection de dispositifs electroniques constitues de differents modules is described in this paper, where influence de modules de hauteurs differentes ou d'espacements entre les modules are discussed.