Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

Methods and systems for utilizing design data in combination with inspection data

A method for performing design rule checking on OPC corrected or otherwise corrected designs is described. This method comprises accessing a corrected design and generating a simulated image. The simulated image corresponds to a simulation of an image which would be printed on a wafer if the wafer were exposed to an illumination source directed through the corrected design. The characteristics of the illumination source are determined by a set of lithography parameters. In creating the image, additional characteristics can be used to simulate portions of the fabrication process. However, what is important is that a resulting simulated image is created. The simulated image can then be used by the design rule checker. Importantly, the simulated image can be processed to reduce the number of vertices in the simulated image, relative to the number of vertices in the OPC corrected design layout. Also, the simulated image can be compared with an idea layout image, the results of which can then be used to reduce the amount of information that is needed to perform the design rule checking.

Design rule checking system and method

A method and apparatus for the correction of integrated circuit layouts for optical proximity effects which maintains the original true hierarchy of the original layout is provided. Also provided is a method and apparatus for the design rule checking of layouts which have been corrected for optical proximity effects. The OPC correction method comprises providing a hierarchically described integrated circuit layout as a first input (205), and a particular set of OPC correction criteria as a second input (260). The integrated circuit layout is then analyzed to identify features of the layout which meet the provided OPC correction criteria (210, 240). After the areas on the mask which need correction have been identified (310), optical proximity correction data (320) is generated in response to the particular set of correction criteria. Finally, a first program data is generated which stores the generated optical proximity correction data in a hierarchical structure (320) that corresponds to the hierarchical structure of the integrated circuit layout (310). As the output correction data is maintained in true hierarchical format, layouts which are OPC corrected according to this method are able to be processed through conventional design rule checkers with no altering of the data.

Data hierarchy layout correction and verification method and apparatus

A method for inspecting lithography masks includes generating integrated circuit design data and using context information from the integrated circuit design data to inspect a mask.

Method and system for context-specific mask inspection

Methods and systems are disclosed to inspect a manufactured lithographic mask, to extract physical mask data from mask inspection data, to determine systematic mask error data based on differences between the physical mask data and mask layout data, to generate systematic mask error parameters based on the systematic mask error data, to create an individual mask error model with systematic mask error parameters, to predict patterning performance of the lithographic process using a particular mask and/or a particular projection system, and to predict process corrections that optimize patterning performance and thus the final device yield.

System and method for mask verification using an individual mask error model

A reusable circuit design for use with electronic design automation EDA tools in designing integrated circuits is disclosed, as well as reticle inspection and fabrication methods that are based on such reusable circuit design. The reusable circuit design is stored on a computer readable medium and contains an electronic representation of a layout pattern for at least one layer of the circuit design on an integrated circuit. The layout pattern includes a flagged critical region which corresponds to a critical region on a reticle or integrated circuit that is susceptible to special inspection or fabrication procedures. In one aspect of the reusable circuit design, the special analysis is performed during one from a group consisting of reticle inspection, reticle production, integrated circuit fabrication, and fabricated integrated circuit inspection.

Mechanisms for making and inspecting reticles

Methods and systems for inspecting a reticle are provided. In an embodiment, a method may include forming an aerial image of the reticle using a set of exposure conditions. The reticle may include optical proximity correction (OPC) features. The method may also include detecting defects on the reticle by comparing the aerial image to a reference image stored in a database. The reference image may be substantially optically equivalent to an image of the reticle that would be printed on a specimen by an exposure system under the set of exposure conditions. The reference image may not include images of the OPC features. Therefore, a substantial portion of the defects include defects that would be printed onto the specimen by the exposure system using the reticle under the set of exposure conditions. The method may also include indicating the defects that are detected in critical regions of the reticle.

Methods and systems for inspecting reticles using aerial imaging and die-to-database detection

Methods and systems for inspecting a reticle are provided. A method may include forming an aerial image of the reticle with an inspection system at a wavelength different from a wavelength of an exposure system. The method may also include correcting the aerial image for differences between modulation transfer functions (MTF) of the inspection system and the exposure system. In this manner, the corrected aerial image may be substantially equivalent to an image of the reticle that would be printed onto a specimen by the exposure system at the wavelength of the exposure system. In addition, the method may include detecting defects on the reticle using the corrected aerial image. The detected defects may include approximately all of the defects that would be printed onto a specimen by the exposure system using the reticle.

Methods and systems for inspecting reticles using aerial imaging at off-stepper wavelengths

Methods and systems for inspecting a reticle are provided. In an embodiment, a system may include an inspection subsystem configured to form a first aerial image of the reticle. The first aerial image may be used to detect defects on the reticle. The system may also include a review subsystem coupled to the inspection subsystem. For example, the inspection and review subsystems may have common optics, separate optics and a common stage, or separate stages and a common handler. The review subsystem may be configured to form a second aerial image of the reticle. The second aerial image may be used to analyze the defects. In another embodiment, the system may include an image computer configured to receive image data from the inspection and review subsystems representing the first and second aerial images. The image computer may also be configured to perform one or more functions on the image data.

Methods and systems for reticle inspection and defect review using aerial imaging

Methods for detecting and classifying defects on a reticle are provided. One method includes acquiring images of the reticle at first and second conditions during inspection of the reticle. The first condition is different than the second condition. The method also includes detecting the defects on the reticle using one or more of the images acquired at the first condition. In addition, the method includes classifying an importance of the defects detected on the reticle using one or more of the images acquired at the second condition. The detecting and classifying steps are performed substantially simultaneously during the inspection.

David S. Alles

Papers

Mechanisms for making and inspecting reticles

Methods and systems for inspecting reticles using aerial imaging and die-to-database detection

Methods and systems for inspecting reticles using aerial imaging at off-stepper wavelengths

Methods and systems for reticle inspection and defect review using aerial imaging

Methods for detecting and classifying defects on a reticle