The interest in superhydrophobic surfaces has grown exponentially over recent decades. Since the lotus leaf dual hierarchical structure was discovered, researchers have investigated the foundations of self-cleaning behavior. Generally, surface micro/nanostructuring combined with low surface energy of materials leads to extreme anti-wetting properties. The great number of papers on this subject attests the efforts of scientists in mimicking nature to generate superhydrophobicity. Besides the thirst for knowledge, scientists have been driven by the many possible industrial applications of superhydrophobic materials in several fields. Many methods and techniques have been developed to fabricate superhydrophobic surfaces, and the aim of this paper is to review the recent progresses in preparing manmade superhydrophobic surfaces.

Recent advances in designing superhydrophobic surfaces.

Over the last ten years, expansion of atmospheric pressure plasma solutions for surface treatment of materials has been remarkable, however direct plasma technology for thin film deposition needs still great effort. The objective of this paper is to establish the state of the art on scientific and technologic locks, which have to be opened to consider direct atmospheric pressure plasma-enhanced chemical vapor deposition (AP-PECVD) a viable option for industrial application. Basic scientific principles to understand and optimize an AP-PECVD process are summarized. Laboratory reactor configurations are reviewed. Reference points for the design and use of AP-PECVD reactors according to the desired thin film properties are given. Finally, solutions to avoid powder formation and to increase the thin film growth rate are discussed.

Atmospheric Pressure Low Temperature Direct Plasma Technology: Status and Challenges for Thin Film Deposition

Atmospheric plasmas for thin film deposition: A critical review

High-temperature capability is critical for polymer dielectrics in the next-generation capacitors demanded in harsh-environment electronics and electrical-power applications. It is well recognized that the energy-storage capabilities of dielectrics are degraded drastically with increasing temperature due to the exponential increase of conduction loss. Here, a general and scalable method to enable significant improvement of the high-temperature capacitive performance of the current polymer dielectrics is reported. The high-temperature capacitive properties in terms of discharged energy density and the charge-discharge efficiency of the polymer films coated with SiO2 via plasma-enhanced chemical vapor deposition significantly outperform the neat polymers and rival or surpass the state-of-the-art high-temperature polymer nanocomposites that are prepared by tedious and low-throughput methods. Moreover, the surface modification of the dielectric films is carried out in conjunction with fast-throughput roll-to-roll processing under ambient conditions. The entire fabrication process neither involves any toxic chemicals nor generates any hazardous by-products. The integration of excellent performance, versatility, high productivity, low cost, and environmental friendliness in the present method offers an unprecedented opportunity for the development of scalable high-temperature polymer dielectrics.

A Scalable, High-Throughput, and Environmentally Benign Approach to Polymer Dielectrics Exhibiting Significantly Improved Capacitive Performance at High Temperatures

Well-defined high resolution structures with excellent electrical conductivities are key components of almost every electronic device. Producing these by printing metal based conductive inks on polymer foils represents an important step forward towards the manufacturing of plastic electronic products on an industrial scale. The development of fast, efficient and inexpensive post-deposition sintering technologies for these materials is an important processing step to make this approach commercially viable. This review discusses the advances in alternative sintering approaches for conductive, metal containing inks, which can be processed by inkjet-printing processes. Each sintering approach is examined regarding its mechanism, its compatibility with commonly used materials in the field of flexible electronics, its compatibility with high-throughput manufacturing processes and its applicability to the production of flexible electronic devices.

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Poly tetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF) and polyvinyl fluoride (PVF) polymer surfaces were exposed to a remote N2 or O2 r.f. plasma. The effect of the plasma power and treatment time on the surface energy and the surface composition were studied by static water contact angle (WCA) and X-ray photoelectron spectroscopy (XPS). In every case, a strong defluorination of the surface was observed. Except for PTFE treated by oxygen, all the surfaces became more hydrophilic after plasma treatment, owing to the grafting of polar nitrogen or oxygen functions. The kinetics of defluorination and grafting seems to be favoured for PVDF and PVF surfaces. Copyright © 2006 John Wiley & Sons, Ltd.

XPS and contact angle study of N2 and O2 plasma-modified PTFE, PVDF and PVF surfaces

In this paper, the deposition and characterization of plasma-polymerized polystyrene (pp-PS) using PECVD under atmospheric pressure on a variety of substrates was investigated. An atmospheric RF plasma torch and an HF dielectric-barrier-discharge (DBD) system were used to deposit thin pp-PS coatings on PTFE, HDPE, stainless steel, glass, and silicon wafer. The styrene vapor was carried by Ar or He. The pp-PS films were characterized by Fourier transform infrared spectroscopy (FTIR) (infrared reflection absorption spectroscopy), X-ray photoelectron spectroscopy (XPS), water contact angle (WCA), static secondary ion mass spectroscopy (SSIMS), and optical microscopy, and the plasma phase was studied by optical-emission spectroscopy. The major features that characterize PS are present in the FTIR, SSIMS, and XPS spectra of our films, although some differences are observed between pp-PS and their conventionally polymerized counterparts: oxygenation, branching, degree of cross-linking, and unsaturation. According to the WCA and XPS results, the films deposited by the RF plasma torch (placed in a Plexiglass chamber) are more oxygenated than those deposited by DBD, which is operated under a much more controlled atmosphere. A comparison of the chemical structure of the deposited coatings (branching, cross-linking) as a function of the nature of the carrier gas was established by FTIR: pp-PS synthesized in the presence of Ar (for both processes) exhibit more branching and a higher degree of cross-linking than pp-PS synthesized with He as the main plasma gas. The optical microscopy points out a diversity of structures that depend on the nature of the substrate and the plasma parameters.

Synthesis of Polystyrene Thin Films by Means of an Atmospheric-Pressure Plasma Torch and a Dielectric Barrier Discharge

Thin sulfonated polystyrene films were prepared by high pressure PECVD of styrene and trifluoromethane sulfonic acid using a DBD. Argon or helium was used as carrier gas. The chemical composition of the pp-sulfonated polystyrene was investigated by XPS, SSIMS, and FTIR. XPS shows that the content in sulfonated groups of the films deposited in the discharge can be tuned by varying the temperature of the acid monomer or by improving the HF voltage. Therefore, the films obtained are rich in ionizable groups (more than Nafion). TOF-SSIMS and FTIR spectra allow to confirm the presence of sulfonic groups (observed on S2p XPS spectra) grafted in the polystyrene matrix.

One Step Polymerization of Sulfonated Polystyrene Films in a Dielectric Barrier Discharge

An organometallic powder (platinum (II) acetylacetonate) is decomposed in the post-discharge of an atmospheric RF plasma torch to deposit Pt nanoparticles on carbon black supports. The resulting nanohybrid materials are characterized by FEG-SEM and XPS techniques to highlight their high content in Pt, their oxidation degree, and the dispersion of the Pt nanoparticles on the substrate. ICP-MS and electrochemical characterizations in a single fuel cell (cyclic voltammetry, dynamic polarization curves) are also performed on electrodes realized by treating the powder mixture overlaid on gas diffusion layers. The comparison of the catalytic activity and the Pt loading with commercially available electrodes shows the great potential of this simple innovative, fast, and robust deposition method.

Delphine Merche

Papers

Atmospheric plasmas for thin film deposition: A critical review

XPS and contact angle study of N2 and O2 plasma-modified PTFE, PVDF and PVF surfaces

Synthesis of Polystyrene Thin Films by Means of an Atmospheric-Pressure Plasma Torch and a Dielectric Barrier Discharge

One Step Polymerization of Sulfonated Polystyrene Films in a Dielectric Barrier Discharge

Fuel Cell Electrodes From Organometallic Platinum Precursors: An Easy Atmospheric Plasma Approach