Series Preface. Preface. Acknowledgements. 1 Structural Properties. 1.1 Ionicity. 1.2 Elemental Isotopic Abundance and Molecular Weight. 1.3 Crystal Structure and Space Group. 1.4 Lattice Constant and Its Related Parameters. 1.5 Structural Phase Transition. 1.6 Cleavage Plane. 2 Thermal Properties. 2.1 Melting Point and Its Related Parameters. 2.2 Specific Heat. 2.3 Debye Temperature. 2.4 Thermal Expansion Coefficient. 2.5 Thermal Conductivity and Diffusivity. 3 Elastic Properties. 3.1 Elastic Constant. 3.2 Third-Order Elastic Constant. 3.3 Young's Modulus, Poisson's Ratio and Similar. 3.4 Microhardness. 3.5 Sound Velocity. 4 Lattice Dynamic Properties. 4.1 Phonon Dispersion Relation. 4.2 Phonon Frequency. 4.3 Mode Gruneisen Parameter. 4.4 Phonon Deformation Potential. 5 Collective Effects and Some Response Characteristics. 5.1 Piezoelectric and Electromechanical Constants. 5.2 Frohlich Coupling Constant. 6 Energy-Band Structure: Energy-Band Gaps. 6.1 Basic Properties. 6.2 E0-Gap Region. 6.3 Higher-Lying Direct Gap. 6.4 Lowest Indirect Gap. 6.5 Conduction-Valley Energy Separation. 6.6 Direct-Indirect-Gap Transition Pressure. 7 Energy-Band Structure: Effective Masses. 7.1 Electron Effective Mass: G Valley. 7.2 Electron Effective Mass: Satellite Valley. 7.3 Hole Effective Mass. 8 Deformation Potentials. 8.1 Intravalley Deformation Potential: G Point. 8.2 Intravalley Deformation Potential: High-Symmetry Points. 8.3 Intervalley Deformation Potential. 9 Electron Affinity and Schottky Barrier Height. 9.1 Electron Affinity. 9.2 Schottky Barrier Height. 10 Optical Properties. 10.1 Summary of Optical Dispersion Relations. 10.2 The Reststrahlen Region. 10.3 At or Near The Fundamental Absorption Edge. 10.4 The Interband Transition Region. 10.5 Free-Carrier Absorption and Related Phenomena. 11 Elastooptic, Electrooptic and Nonlinear Optical Properties 11.1 Elastooptic Effect. 11.2 Linear Electrooptic Constant. 11.3 Quadratic Electrooptic Constant. 11.4 Franz-Keldysh Effect. 11.5 Nonlinear Optical Constant. 12 Carrier Transport Properties. 12.1 Low-Field Mobility: Electrons. 12.2 Low-Field Mobility: Holes. 12.3 High-Field Transport: Electrons. 12.4 High-Field Transport: Holes. 12.5 Minority-Carrier Transport: Electrons in p-Type Materials. 12.6 Minority-Carrier Transport: Holes in n-Type Materials. 12.7 Impact Ionization Coefficient. Index.

Properties of group-IV, III-V and II-VI semiconductors

A review on magnetic field assisted electrical discharge machining

Abstract Laser-induced plasma micro-machining (LIPMM) process does well in fabricating high-quality surface microstructures of hard and brittle materials. However, the liquid medium is overheated to induce lots of bubbles to defocus the laser beam, reducing machining stability, and explosive behavior of bubbles destroys the surface quality. Thus, the static and dynamical behaviors of bubbles in LIPMM are comprehensively investigated in this article. First, a series of mechanisms including bubble generation and growth, bubble motion and explosion, and the effect of bubbles behavior on machining characteristics were explained. Second, a volume of fluid (VOF) model of bubble motions in laser-induced plasma micro-machining was established to simulate the dynamical behavior of bubbles under different depths of water layer, which reflect the growth of microbubbles, the aggregation of multiple bubbles, and the floating movement of bubbles. Then, a series of experiments were carried out to reveal bubble static behaviors, and further bubble explosion behaviors on surface integrity, surface defects, and hardness were analyzed. The increase of laser frequency leads to the increase of the maximum attached bubble size. Obstructed by bubble dynamical behaviors, a discontinuous section and the unablated area are observed in the microchannel. The elastic modulus and surface hardness of surface impacted by explosion bubbles are reduced. This research contributes to better understanding bubble behavior related to machining performances in LIPMM of single-crystal silicon. 

Bubble Behavior and Its Effect on Surface Integrity in Laser-Induced Plasma Micro-Machining Silicon Wafer

UV laser high-quality drilling of CFRP plate with a new interlaced scanning mode

Fabrication and Droplet Impact Performance of Superhydrophobic Ti6al4v Surface by Laser Induced Plasma Micro-Machining

Study on machining characteristics of magnetically controlled laser induced plasma micro-machining single-crystal silicon

The force effect of the shockwave generated by the short-pulse and ultra-short-pulse laser enables the laser to enhance the mechanical properties of the material without ablating the material, improve the microstructure, change the shape of the material, and remove the tiny particles attached to the surface of the material, etc. Therefore, it is widely used in surface strengthening, surface cleaning, metal forming, etc. Laser shock peening (LSP) and laser shock cleaning (LSC) are two applications of laser shockwave in surface processing. The force effect of the laser shockwave allows non-thermal treatment has been used in aerospace, biomedical, semiconductor, etc. This paper reviews the principle of laser shockwave effects and the existing processing methods of short laser-included plasma shockwave; the numerical model of laser shock effects, including the laser–material interaction model and surface processing model; the effects of laser parameters on processing performance; the mechanical properties, the microstructure, and the surface features; finally, the future research and development of laser shock effect are prospected. 

Progress in applications of shockwave induced by short pulsed laser on surface processing

• LIPMD is proposed to improve the quality and accuracy of laser drilling of CFRP plates. • The comparative analysis on machinability and surface integrity of CFRP plate by LIA and LIPMD is conducted. • Taper, recast layer, and roundness of CFRP micro-holes are significantly improved. • Smooth kerf and small taper of CFRP micro-holes are obtained. Carbon fiber reinforced plastic (CFRP) is being widely used due to its excellent mechanical properties and corrosion resistance. However, CFRP with the characteristics of anisotropy and inhomogeneous result in difficulty to drill micro-holes. Traditional methods are used to drill micro-holes resulting in poor performance, such as fiber pull-out, tool wear, and bad processed surface quality. Laser machining has great potential on drilling CFRP micro-holes without tool wear and fiber pull-out, but leads to large taper and recast layer. In this study, laser induced plasma micro-drilling (LIPMD) was proposed to reduce the taper as well as improve the processed surface integrity. A comprehensive analysis processed sidewall surface quality, taper, roundness and surface integrity were conducted, and LIPMD process showed more advantages over laser in air (LIA). It is concluded that the processed sidewall machined by the LIPMD has less epoxy recast layer, and the surface of fiber is smoother than that of in the LIA process, diameter difference between the top and bottom of micro-holes is reduced by about 24.83%-32.02%, and the taper is reduced by 32.02%-47.44% compared with the LIA process. This investigation demonstrates the applicability of the LIPMD as a potential process for improved machinability and surface integrity of CFRP material. 

Denghua Liu

Papers

Study on machining characteristics of magnetically controlled laser induced plasma micro-machining single-crystal silicon

Fabrication and Droplet Impact Performance of Superhydrophobic Ti6al4v Surface by Laser Induced Plasma Micro-Machining

Progress in applications of shockwave induced by short pulsed laser on surface processing

Comparative investigations on machinability and surface integrity of CFRP plate by picosecond laser vs laser induced plasma micro-drilling