The present invention relates to a device for aligning an X-ray grating to an X-ray radiation source, the device (10) comprising at least two flat X-ray grating segments (11-19); at least one alignment unit (31-39) for aligning one of the at least two flat X-ray grating segments; wherein the at least two flat X-ray grating segments (11-19) are arranged in juxtaposition and are forming an X-ray grating (20); wherein the at least two flat X-ray grating segments (11-19) each comprise a grating surface (41-49) for X-ray radiation, each grating surface (41-49) comprising a geometrical center; wherein normals (21-29) to each of the grating surfaces (41-49) define a common plane (73), wherein the normals (21-29) intersect the geometrical center of the grating surface (41-49); wherein at least a first of the at least two flat X-ray grating segments (11-19) is rotatable around an axis (131-139) that is perpendicular to the common plane (73); and wherein the first of the at least two flat X-ray grating segments (11-19) that is rotatable around the axis (131-139) is connected to a first of the at least one alignment unit (31-39). The invention provides a device (10) and a method (100) which provide an improved X-ray grating (20).

Device and method for aligning an X-ray grating to an X-ray radiation source, and X-ray image acquisition system

A method for producing a microstructure component, a microstructure component and an x-ray device are disclosed. In the method, a plurality of punctiform injection structures are inserted in a grid in a first substrate direction and a second substrate direction, standing at right angles thereto, into a first surface of a wafer-like silicon substrate. The injection structures are lengthened into drilled holes in the depth direction of the silicon substrate in a first etching step. A second surface of the silicon substrate is then at least partly removed for rear-side opening of the drilled holes in a second etching step and in a third etching step, an etching medium acting anisotropically is poured alternately through the drilled holes from both surfaces of the silicon substrate, so that drilled holes arranged next to one another in the first substrate direction connect to form a column running in the first substrate direction.

Deutinger Andrea

Papers

Method for producing a microstructure component, microstructure component and x-ray device