D
Do-Sun Lee
Researcher at Samsung
Publications - 22
Citations - 181
Do-Sun Lee is an academic researcher from Samsung. The author has contributed to research in topics: Layer (electronics) & Semiconductor device. The author has an hindex of 9, co-authored 22 publications receiving 180 citations.
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Patent
Semiconductor devices including stress relief structures
TL;DR: A microelectronic device includes a substrate having at least one micro-electronic component on a surface thereof, a conductive via electrode extending through the substrate, and a stress relief structure including a gap region therein extending into the surface of the substrate between the via electrode and the microelectronics component.
Patent
Integrated circuit device including through-silicon via structure having offset interface
Su-kyoung Kim,Gil-heyun Choi,Byung-Iyul Park,Kwang-jin Moon,Kun-Sang Park,Dong-Chan Lim,Do-Sun Lee +6 more
TL;DR: In this paper, a Through-Silicon Via (TSV) structure is provided in the first through-hole and the second throughhole, and the TSV structure extends to pass through the substrate and the interlayer insulating film.
Patent
Semiconductor devices including through silicon via electrodes and methods of fabricating the same
Do-Sun Lee,Byung Lyul Park,Gil-heyun Choi,Kwang-jin Moon,Kun-Sang Park,Suk-Chul Bang,Seong-min Son +6 more
TL;DR: A semiconductor device may include a semiconductor substrate, a through via electrode, and a buffer as mentioned in this paper, and the buffer may be in the inner portion of the semiconductor substrates with the through-via electrode surrounding and spaced apart from the buffer.
Proceedings ArticleDOI
Fin-channel-array transistor (FCAT) featuring sub-70nm low power and high performance DRAM
Do-Sun Lee,Byeong-Chan Lee,In-Sun Jung,Taek Kim,Yong-Hoon Son,Sun-Ghil Lee,Young-pil Kim,Si-Young Choi,U-In Chung,Joo-Tae Moon +9 more
TL;DR: In this article, a highly manufacturable fin-channel array transistor (FCAT) on a bulk Si substrate has been successfully integrated in a 512 M density DRAM with sub-70nm technology.
Patent
Integrated Circuit Device Having Through-Silicon-Via Structure and Method of Manufacturing the Same
TL;DR: In this paper, an integrated circuit device including a through-silicon-via (TSV) structure and methods of manufacturing the same are provided, which may include the TSV structure penetrating through a semiconductor structure.