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Dongyang Li

Researcher at University of Alberta

Publications -  297
Citations -  7994

Dongyang Li is an academic researcher from University of Alberta. The author has contributed to research in topics: Corrosion & Microstructure. The author has an hindex of 43, co-authored 277 publications receiving 6525 citations. Previous affiliations of Dongyang Li include McGill University & Jinan University.

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Influence of surface morphology on corrosion and electronic behavior

TL;DR: In this paper, the influence of surface morphology, represented by roughness, on the corrosion and electronic behavior of copper was investigated using an atomic force microscope and a scanning Kelvin probe.
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Mechanical and electrochemical behavior of nanocrystalline surface of 304 stainless steel

TL;DR: In this paper, the nanocrystalline surface layer of 304 stainless steel (304SS) produced using a sandblasting and annealing process was investigated using nano/micro/-indentation, micro-scratch, scanning Kelvin probe (SKP), potentiodynamic scanning and electrochemical scratch techniques.
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Enhancement of fatigue and corrosion properties of pure Ti by sandblasting

TL;DR: The peak subsurface compressive residual stress produced by sandblasting was measured by XRD to be around 480 MPa as mentioned in this paper, and three distinct regions were observed in the sandblasted samples, namely severely deformed surface layer, the region deformed mainly by twinning, and the substrate.
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Mechanical, electrochemical and tribological properties of nano-crystalline surface of 304 stainless steel

TL;DR: In this paper, the tribological behavior and related properties of a nano-crystalline surface of 304 stainless steel (304SS) produced by a sandblasting and annealing process were investigated using micro- and nano-mechanical probes, a scanning Kelvin probe, an electrochemical system and a tribometer.
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Tribological, mechanical and electrochemical properties of nanocrystalline copper deposits produced by pulse electrodeposition

TL;DR: In this article, nanocrystalline and micro-crystalline copper deposits were produced by pulse and direct current electrodeposition processes respectively, and the effects of deposition parameters, such as the peak density, frequency, current-on time and current-off time of the pulse current (PC), on the grain size were investigated for the purpose of process optimization.