The applications of ferrimagnetic oxides, or ferrites, in the last 10 years are reviewed, including thin films and nanoparticles. The general features of the three basic crystal systems and their magnetic structures are briefly discussed, followed by the most interesting applications in electronic circuits as inductors, in high-frequency systems, in power delivering devices, in electromagnetic interference suppression, and in biotechnology. As the field is considerably large, an effort has been made to include the original references discussing each particular application on a more detailed manner.

/pdf/novel-applications-of-ferrites-kbploms6oi.pdf

Novel Applications of Ferrites

Fully Inkjet‐Printed Transparent Oxide Thin Film Transistors Using a Fugitive Wettability Switch

A review of some of the available technologies for inductor hybrid integration is given in this paper. In accordance with low voltage and high current requirements, low-temperature co-fired ceramics (LTCC) technology is identified to be a suitable candidate for power electronics passives integration. This paper will discuss the various limitations of the current LTCC processing technique and introduce a fabrication technique which will open a new field for chip inductors for hybrid power electronics integration. The design of an LTCC inductor will also be presented. This inductor exhibits an inherent current dependent inductance, leading to high efficiency at low loads as an important systems advantage in portable electronics.

A Class of Ceramic-Based Chip Inductors for Hybrid Integration in Power Supplies

Structural health management technologies for inflatable/deployable structures: Integrating sensing and self-healing

Photovoltaic power systems, consisting of solar modules, energy storage, and power management electronics, are of great importance for applications ranging from off-grid and portable power to ambient light harvesting for sensor nodes. Co-design and integration of the components using printing and coating methods on flexible substrates enable the production of effective and customizable systems for these diverse applications. In this paper, we review photovoltaic module and energy storage technologies suitable for integration into flexible power systems. We discuss the design of electrical characteristics for these systems that enable them to power desired loads efficiently, as well as strategies for physically combining the components. Functions and design considerations of power management electronics are presented along with recent progress toward printed and flexible power electronics. We analyze both hybrid and fully flexible photovoltaic systems and the critical role of the application in the choices of materials and architectures for the system components.

https://iopscience.iop.org/article/10.1088/2058-8585/aa5750/pdf

Flexible photovoltaic power systems: integration opportunities, challenges and advances

A low-profile microinductor was fabricated on a copper-clad polyimide substrate where the current carrying coils were patterned from the existing metallization layer and the magnetic core was printed using a magnetic ceramic-polymer composite material. Highly loaded ferrite-polymer composite materials were formulated, yielding adherent films with 4/spl pi/M/sub s//spl ap/3900 G at +5000 Oe applied DC field. These composite magnetic films combine many of the superior properties of high temperature ceramic magnetic materials with the inherent processibility of polymer thick films. Processing temperatures for the printed films were between 100/spl deg/C and 130/spl deg/C, facilitating integration with a wide range of substrates and components. The quality factor of the microinductor was found to peak at Q=18.5 near 10 MHz, within the optimal frequency range for power applications. A flat, nearly frequency independent inductance of 1.33 /spl mu/H was measured throughout this frequency range for a 5 mm/spl times/5 mm component, with a DC resistance of 2.6 /spl Omega/ and a resonant frequency of 124 MHz. The combination of printed ceramic composites with organic/polymer substrates enables new methods for embedding passive components and ultimately the integration of high Q inductors with standard integrated circuits for low profile power electronics.

E.J. Brandon

Papers

Printed microinductors on flexible substrates for power applications