/pdf/merging-data-sources-to-predict-remaining-useful-life-an-2j6tjvybey.pdf

Merging Data Sources to Predict Remaining Useful Life – An Automated Method to Identify Prognostic Parameters

This report reviews the current state of the art of prognostics and health management (PHM) for nuclear power systems and related technology currently applied in field or under development in other technological application areas, as well as key research needs and technical gaps for increased use of PHM in nuclear power systems. The historical approach to monitoring and maintenance in nuclear power plants (NPPs), including the Maintenance Rule for active components and Aging Management Plans for passive components, are reviewed. An outline is given for the technical and economic challenges that make PHM attractive for both legacy plants through Light Water Reactor Sustainability (LWRS) and new plant designs. There is a general introduction to PHM systems for monitoring, fault detection and diagnostics, and prognostics in other, non-nuclear fields. The state of the art for health monitoring in nuclear power systems is reviewed. A discussion of related technologies that support the application of PHM systems in NPPs, including digital instrumentation and control systems, wired and wireless sensor technology, and PHM software architectures is provided. Appropriate codes and standards for PHM are discussed, along with a description of the ongoing work in developing additional necessary standards. Finally, an outline of key researchmore » needs and opportunities that must be addressed in order to support the application of PHM in legacy and new NPPs is presented.« less

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Prognostics and Health Management in Nuclear Power Plants: A Review of Technologies and Applications

This paper presents test results and specifications for SJ BISTTM, an innovative sensing method for detecting faults in solder-joint networks that belong to the I/O ports of field programmable gate arrays (FPGAs), especially in ball grid array packages. It is well-known that fractured solder joints typically maintain sufficient electrical contact to operate correctly for long periods of time. Subsequently the damaged joint begins to exhibit intermittent failures: the faces of a fracture separate during periods of stress, causing incorrect FPGA signals. SJ BIST detects faults of 100 Omega or lower with zero false alarms: minimum detectable fault period is one-half the period of the FPGA clock; guaranteed detection is two clock periods. Being able to detect solder joint faults in FPGAs increases fault coverage and health management capabilities, and provides support for condition-based and reliability-centered maintenance.

Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST

Prognostics-enablement of power actuator components involves acquisition and processing of multiple data and sensor inputs. Data collection and fusion creates an accurate prognostic prediction. To that end, Ridgetop has developed an extensible Prognostic Analysis System Platform and a companion Prognostics Telemetry Harness. With an electro-mechanical actuator (EMA) as the focus, this paper describes the extensible architecture for a prognostics health management (PHM) system providing state of health (SoH) and remaining useful life' (RUL) metrics. The key enabler is the ridgetop prognostics telemetry harness (RPTH), which collects and preprocesses signals relating to the health of dynamically executing components and subsystems. With an ultimate target of 100% up-time, prognostics is an effective tool for managing the corrective early actions required to avoid costly down-time events. An example is detailed using a common EMA and further analysis explores the return-on-investment justifying prognostics adoption.

Electronic Prognostics System Implementation on Power Actuator Components

................................................................................................................................................ iii SUMMARY .................................................................................................................................................. v ACRONYMS ................................................................................................................................................ x ACKNOWLEDGMENTS ......................................................................................................................... xiii

/pdf/lifecycle-prognostics-architecture-for-selected-high-cost-3sxyyp7dxy.pdf

Lifecycle Prognostics Architecture for Selected High-Cost Active Components

In this paper we present two sensors for real-time detection of solder-joint faults in programmed, operational field programmable gate arrays (FPGAs), especially those FPGAs in ball grid array (BGA) packages. The first sensor uses a method in-situ within the FPGA and the second sensor uses a method external to the FPGA. Initial testing indicates the first method is capable of detecting high-resistance faults of 100 Omega or lower and which last one-half a clock period or longer. A prototype of the second method detected high-resistance faults of at least 150 Omega that lasted as low as 25 ns.

/pdf/real-time-detection-of-solder-joint-faults-in-operational-33fmtgdugv.pdf

Real-Time Detection of Solder-Joint Faults in Operational Field Programmable Gate Arrays

An update on a method (SJ BISTtrade) to detect intermittencies in Ball Grid Array (BGA) packages is presented, and another method (SJ Monitortrade) is introduced. SJ BISTtrade is primarily firmware embedded in the FPGA application; SJ Monitortrade is hardware on an IC chip. Failure of monitored I/O pins on operational, fully-programmed FPGAs is reported by SJ BIST and SJ Monitor to provide positive indication of damage to one or more I/O solder-joint networks of an FPGA on an electronic digital board. The board can then be replaced before accumulated fatigue damage results in intermittent or long-lasting operational faults.

Intermittency detection and mitigation in Ball Grid Array (BGA) packages

In this paper we introduce a solder- joint built-in-self-test (SJ BIST) for detecting high-resistance and intermittent faults in operational, fully programmed field programmable gate arrays (FPGAs). The approach is simple to implement, offers a method to detect high-resistance faults that result from damaged solder joints, and uses a maximum of one small capacitor externally connected to each selected test pin or each group of two test pins.

/pdf/real-time-bist-detector-for-bga-faults-in-field-programmable-5p9fcpsy5v.pdf

Real-Time BIST Detector for BGA Faults in Field Programmable Gate Arrays (FPGAs)

The authors present a sensor for real-time detection of solder-joint faults in programmed, operational Field Programmable Gate Arrays (FPGAs), especially those FPGAs in Ball Grid Array (BGA) packages, such as a XILINX® FG1156 [1]. FPGAs are used in all manner and kinds of control systems in aerospace applications. The ability to sense high-resistance faults in the solder joints of operational FPGAs increases both fault coverage and electronic Prognostics Health Management (ePHM) capabilities and support for condition-based and reliabilitycentered maintenance. As both the pitch between the solder balls of the solder joints of BGA packages and the diameter of the solder balls decrease, the importance of this sensor increases.

Edgar Ortiz

Papers

Real-Time Detection of Solder-Joint Faults in Operational Field Programmable Gate Arrays

Intermittency detection and mitigation in Ball Grid Array (BGA) packages

Real-Time BIST Detector for BGA Faults in Field Programmable Gate Arrays (FPGAs)

A Sensor for Real-Time Detection of Solder-Joint Faults in Operational Field Programmable Gate Arrays