Disclosed is an aqueous plating bath suitable for obtaining electrodeposits of palladium and its alloys. The bath is substantially free of cyanide, nitrate and nitrite, and comprises sulfite ion, palladium in the form of a tetra-coordinated complex with palladium in the +2 oxidation state, an atomic ratio of halide to palladium not in excess of 10, and exhibits a pH of from 7 to 12.

Palladium electroplating bath, process, and preparation

A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

High speed method for plating palladium and palladium alloys

This invention relates to the palladium plating of electrical parts, such as frames, pins, connectors and in general various types of electrical contacts. More particularly, this invention relates to a method and composition for high speed electroplating of uniform, bright palladium deposits over a wide operating current density range using a palladosammine chloride plating bath to which sodium sulfite has been added. The method is adapted for rack plating of parts having an irregular shaped configuration as well as those having a uniform configuration.

Method and composition for plating palladium

Alkaline aqueous electrolytes for the electrodeposition of palladium comprising a soluble palladium compound, one or more complexing agents of an organic compound containing a heterocyclic ring having one or more nitrogen atoms in the ring position, at least one carboxyl group substituted on a ring carbon, and at least one hydroxyl or carbonyl oxygen attached to a ring carbon. The palladium compound and complexing agents are soluble in the electrolyte. Optionally, one or more soluble alloying metal compounds can be added to the electrolyte when palladium alloys are to be electrodeposited therefrom. Also, methods for formulating these electrolytes and for electrodepositing palladium or palladium alloys therefrom.

Alkaline baths and methods for electrodeposition of palladium and palladium alloys

The present invention relates to an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds to both stabilize the bath and to provide white palladium deposits over a wide range of plating thicknesses.

Electroplating bath and process for white palladium

An electroplating bath for the deposition of palladium from a palladium-urea complex. A method for depositing palladium from a chemical solution containing a palladium-urea complex by passing an electric current through the solution, whereupon palladium deposits on the surface of a workpiece or a cathode.

Franco Zuntini

Papers

Electrodeposition of palladium