Patent
Electrodeposition of palladium
TLDR
An electroplating bath for the deposition of palladium from a palladium-urea complex was proposed in this paper, where an electric current was passed through the solution, whereupon palladium deposits on the surface of a workpiece or a cathode.Abstract:
An electroplating bath for the deposition of palladium from a palladium-urea complex. A method for depositing palladium from a chemical solution containing a palladium-urea complex by passing an electric current through the solution, whereupon palladium deposits on the surface of a workpiece or a cathode.read more
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Patent
Palladium electroplating bath, process, and preparation
TL;DR: In this paper, an aqueous plating bath suitable for obtaining electrodeposits of palladium and its alloys is described, which is substantially free of cyanide, nitrate and nitrite.
Patent
High speed method for plating palladium and palladium alloys
TL;DR: In this paper, a high speed method of depositing palladium and palladium alloys is described, which uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath.
Patent
Method and composition for plating palladium
TL;DR: In this article, a method and composition for high speed electroplating of uniform, bright palladium deposits over a wide operating current density range using a palladosammine chloride plating bath to which sodium sulfite has been added.
Patent
Alkaline baths and methods for electrodeposition of palladium and palladium alloys
TL;DR: Alkaline aqueous electrolytes for the electrodeposition of palladium comprising a soluble palladium compound, one or more complexing agents of an organic compound containing a heterocyclic ring, at least one carboxyl group substituted on a ring carbon.
Patent
Electroplating bath and process for white palladium
Jun Vincent Paneccasio,Elena Too +1 more
TL;DR: In this paper, an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds was proposed to both stabilize the bath and to provide white palladium deposits over a wide range of plating thicknesses.
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