A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first resin film is formed so as to cover a first wiring layer. Thereafter, a first through-hole is formed, which penetrates the first resin film and exposes the first wiring layer from a bottom thereof. Next, a second resin film is formed so as to fill up the first through-hole. Moreover, a second through-hole is formed in the second resin film buried in the first through-hole, and a connection part is formed.

Circuit device and manufacturing method thereof

An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.

Flip chip heat sink package and method

A power tool includes a tool housing, an electric motor inside the housing, and a power interface facilitating a connection to a power source. At least four actively-controlled power components are configured as an H-bridge to modulate a supply of power from the power interface to the electric motor. A user-actuated input unit outputs a first signal indicative of a desired power output level to the electric motor and a second signal indicative of a desired direction of current flow to the electric motor. A control unit controls the supply of power to the electric motor using two of said power components with synchronous rectification for pulse-width modulation (PWM) of the supply of power based on the first signal, and to control the direction of current flow to the electric motor using the other two of said power components based on the second signal.

Electronic switching module for a power tool

A method of depositing large particles having an average nominal diameter of greater than 106 microns up to 250 microns onto substrates using a kinetic spray system is disclosed. The method utilizes a powder injector tube having a reduced inner diameter and a de Laval type nozzle having an elongated throat to exit end length. The method permits deposition of much larger particles than previously possible.

Method of producing a coating using a kinetic spray process with large particles and nozzles for the same

Disclosed is a system and a method for simultaneously applying a kinetic spray coating and a thermal spray coating onto a substrate using a single application nozzle to produce a combined coating. The system may include a higher heat capacity gas heater to permit both the thermal spray and the kinetic spray. The method involves providing two populations of particles to the nozzle simultaneously wherein one population is thermally softened in the nozzle under the spray parameters and the other is not. The system increases the versatility of the spray nozzle and addresses several problems inherent in kinetic spray applied coatings.

Spray system with combined kinetic spray and thermal spray ability

An ink composition is provided for forming an ultra-thick thick film which is suitable for conducting heat laterally from a heat generating device supported on a substrate. The ink composition is formulated to enable the ultra-thick thick film to be formed as a single layer, such that only a single print, dry and fire cycle is required to form the film. Advantageously, ultra-thick thick films having thicknesses of about 125 micrometers (about 0.005 inch) and greater can be formed by a single layer of the ink composition.

Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit

A hybrid circuit structure that includes a metal substrate, an inorganic electrical insulator layer and at least one inorganic thick-film passive circuit element, such as a thick-film resistor, capacitor or conductor. An interface layer is provided between the insulator layer and the circuit element to prevent the detrimental effects of interlayer diffusion. The composition of the interface layer is selected to prevent the diffusion of constituents from the inorganic insulator layer, and to have a CTE near that of the circuit element to reduce thermal fatigue. As a result, the passive circuit element can be formed of essentially any one of a number of conventional inorganic thick-film materials that are widely used on alumina substrates.

Method of forming thick-film hybrid circuit on a metal circuit board

An inductive sensing element for sensing displacement of a resilient flexible beam or diaphragm. The inductive sensing element comprises an open faced member and a closed faced member one of which is attachable to the flexible beam and the other of which is attachable to a stationary member. The parameters of both the open and closed faced members are selected so that the self-inductance of the open faced member is determined by the overall distance separating the members. Both the open and closed faced members have a magnetic coating and the open face member further comprises an electrically conductive coating arranged in a predetermined pattern on its magnetic coating. The self- inductance of the open faced member, in particular, the predetermined pattern, is dependent upon the magnetic coating on the open faced member and the magnetic contribution that the magnetic coating of the closed faced member makes to the magnetic coating of the open faced member which, in turn, is dependent upon the overall distance separating the open and closed faced members.

Inductive proximity sensor

A rotational accelerometer has a pair of coplanar, operationally independent linear acceleration sensors. Coplanarity is provided by a unitary substrate which forms the base structure of the operationally independent linear acceleration sensors.

Thick film rotational accelerometer having two structurally integrated linear acceleration sensors

An improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The dielectric features are precisely defined by an initial thin layer of dielectric material, referred to as a feature definition print, or FDP. After the FDP has been dried but not yet fired, a via can be formed by printing a comparatively thick cover layer of dielectric, over-lapping the edges of the FDP. Due to the porous nature of the dried but not fired FDP, it absorbs solvent from the dielectric cover layer, which inhibits the spreading of the dielectric cover layer. The FDP is then co-fired with the first dielectric layer, and a second dielectric layer may be provided atop the fired first layer to further increase the overall dielectric thickness, if so desired. This results in a thicker dielectric layer for the same number of successive printing steps, and at the same time, smaller dielectric features. The thicker dielectric layer provides improved isolation between circuit layers, and the smaller dielectric features increase the available surface area for conductors and components on the upper dielectric layer. Additionally, process robustness is improved, since there is less fine tuning and batch-to-batch variation when used in high volume production.

Frans Peter Lautzenhiser

Papers

Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit

Method of forming thick-film hybrid circuit on a metal circuit board

Inductive proximity sensor

Thick film rotational accelerometer having two structurally integrated linear acceleration sensors

Method of manufacture for a thick film multi-layer circuit