Delphi Automotive

About: Delphi Automotive is a company organization based out in Troy, Michigan, United States. It is known for research contribution in the topics: Signal & Internal combustion engine. The organization has 7472 authors who have published 10389 publications receiving 143422 citations.

Stability analysis of networked control systems

Abstract: We introduce a novel control network protocol, try-once-discard (TOD), for multiple-input-multiple-output (MIMO) networked control systems (NCSs), and provide an analytic proof of global exponential stability for both the new protocol and the more commonly used (statically scheduled) access methods. Our approach is to first design the controller using established techniques and considering the network transparency, and then analyze the effect of the network on closed-loop system performance. When implemented, an NCS consists of multiple independent sensors and actuators competing for an access to the network, with no universal clock available to synchronize their actions. Since the nodes act asynchronously, we allow access to the network at anytime, but assume each access occurs before a prescribed deadline, known as the maximum allowable transfer interval. Only one node may access the network at a time. This communication constraint imposed by the network is the main focus of the paper. The performance of the new TOD protocol and the statically scheduled protocols are examined in simulations of an automotive gas turbine and an unstable batch reactor.

Topological overview of hybrid electric and fuel cell vehicular power system architectures and configurations

Abstract: This paper discusses the operational characteristics of the topologies for hybrid electric vehicles (HEV), fuel cell vehicles (FCV), and more electric vehicles (MEV). A brief description of series hybrid, parallel hybrid, and fuel cell-based propulsion systems are presented. The paper also presents fuel cell propulsion applications, more specific to light-duty passenger cars as well as heavy-duty buses. Finally, some of the major fundamental issues that currently face these advanced vehicular technologies including the challenges for market penetration are highlighted.

Thermopower enhancement in lead telluride nanostructures

Abstract: We demonstrate an enhancement in the thermopower of PbTe nanostructures with grain sizes on the order of $30--50\phantom{\rule{0.3em}{0ex}}\mathrm{nm}$, relative to bulk. The enhancement is similar in magnitude to that reported in the literature for $\mathrm{Pb}\mathrm{Te}∕\mathrm{Pb}{\mathrm{Se}}_{x}{\mathrm{Te}}_{1\ensuremath{-}x}$ quantum dot superlattices. We provide proof, based on measurements of the transverse Nernst effect, that the enhancement has its origin in electron energy filtering induced by an alteration of the scattering mechanism.

Estimation of the isotope effect on the lattice thermal conductivity of group IV and group III-V semiconductors

Abstract: The isotope effect on the lattice thermal conductivity for group IV and group III-V semiconductors is calculated using the Debye-Callaway model modified to include both transverse and longitudinal phonon modes explicitly. The frequency and temperature dependences of the normal and umklapp phonon-scattering rates are kept the same for all compounds. The model requires as adjustable parameters only the longitudinal and transverse phonon Gr\"uneisen constants and the effective sample diameter. The model can quantitatively account for the observed isotope effect in diamond and germanium but not in silicon. The magnitude of the isotope effect is predicted for silicon carbide, boron nitride, and gallium nitride. In the case of boron nitride the predicted increase in the room-temperature thermal conductivity with isotopic enrichment is in excess of 100%. Finally, a more general method of estimating normal phonon-scattering rate coefficients for other types of solids is presented.

Temperature sensor with flexible circuit substrate

Abstract: A temperature sensor incorporating flexible circuit technology. A flexible circuit sensor subassembly is composed of a flexible printed circuit substrate on which is printed a sensor circuit. In a preferred example the flexible circuit sensor subassembly, the sensor circuit has a sensor at a distal end, as for example a surface mount device (SMD) thermistor, a plurality of trace pads at a proximate end, and an interconnecting conductive trace between each trace pad and the sensor. A crimp terminal is respectively crimped onto each trace pad to provide a flexible circuit sensor assembly, wherein the crimp terminals are configured as needed for interfacing with an external circuit. The location of the sensor may be selectively located anywhere on the conductive traces to thereby easily size the probe length of the flexible circuit sensor subassembly to suit a any particular application and fit into any housing. A housing id molded over the flexible circuit sensor assembly. The housing either alone or located in an external shell provides a temperature sensor for a particular purpose. In a variation of the flexible circuit sensor assembly, electronic components can be integrated with the sensor circuit to provide a smart sensor circuit, which may include multiple sensing devices.