Showing papers by "Fred Barlow published in 1998"

Multilayer interconnects for a high power packaging strategy

Abstract: The researchers at Virginia Tech have developed a power packaging strategy which extends the concept of Multichip Modules (MCMs) to high power electronics assemblies dealing with power levels into the Kilowatt range This paper discusses an approach which allows for a high conductivity metal layer for power routing and up to ten layers for signal routing in a single compact module Low power control and interface circuits are integrated into the power module in bare die and packaged form using chip and wire, as well as surface mount attachment techniques Proper thermal management is achieved through the use of Metal Matrix Composite (MMC) heat spreaders and Aluminum Nitride (AlN) substrate materials Three kilowatt half-bridge power converters have been fabricated using both the conventional approach and this packaging concept in order to compare and illustrate the advantages of this concept The scope of this paper will cover the electronic packaging strategy as well as the MCM-L fabrication approach developed by the researchers in the Microelectronics Laboratories at Virginia Tech

Integrated power modules (IPMs), a novel MCM approach to high power electronics design and packaging

Abstract: The researchers in the Microelectronics Laboratory at Virginia Tech have developed a power packaging strategy which utilizes pa ckaging materials to apply a unique multilayer topology design, and extends the concept of Multichip Modules (MCM) to high power electr nics assemblies. This paper discusses the Integrated Power Module (IPM), which consists of a high conductivity metal layer for powe r routing and up to ten layers for signal routing in a single standard compact module. Low power control and interface circuits are inte grated into the power module in bare die form and packaged form using chip and wire, as well as surface mount attachment techniques. Proper th ermal management is achieved through the use of Metal Matrix Composite (MMC) heat spreader and high conductivity substrate materials, the topic of which has been thoroughly discussed by these authors in previous papers. This paper will address the current standard technology to realize power converter packaging design and miniaturization as well as the disadvantages involved with such an approach. Potential solutions to specific design and materials issues will be proposed, th e packaging strategy discussed, the fabrication processes explained, and the concept experimentally validated in the form of a 3kW DC-AC ha lf-bridge power converter.