Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

The mechanical properties of thin-film, low-pressure chemical vapor deposited silicon nitride were measured in uniaxial tension and by a bulge test method suitable for wafer-level testing. This research compares the two approaches and presents additional data on silicon nitride. The common property from the two test methods is the Young's modulus. Tensile tests performed at the Johns Hopkins University provided a value of 257±5 GPa. Bulge tests conducted by Exponent, Inc., an engineering and scientific consulting firm, yielded a value of 258±1 GPa. It is concluded that this bulge test is a valid wafer-level test method. These tensile results, when added to earlier results, yield the following properties for low-stress silicon nitride: Young's modulus =255±5 GPa, Poisson ratio=0.23±0.02, and fracture strength=5.87±0.62 GPa.

Comparison of tensile and bulge tests for thin-film silicon nitride

Microbridge testing of silicon nitride thin films deposited on silicon wafers

The objective of this work is to present a brief overview of a probabilistic design methodology for brittle structures, review the literature for evidence of probabilistic behavior in the mechanical properties of MEMS (especially strength), and to investigate whether evidence exists that a probabilistic Weibull effect exists at the structural microscale. Since many MEMS devices are fabricated from brittle materials, that raises the question whether these miniature structures behave similar to bulk ceramics. For bulk ceramics, the term Weibull effect is used to indicate that significant scatter in fracture strength exists, hence requiring probabilistic rather than deterministic treatment. In addition, the material's strength behavior can be described in terms of the Weakest Link Theory (WLT) leading to strength dependence on the component's size (average strength decreases as size increases), and geometry/loading configuration (stress distribution). Test methods used to assess the mechanical properties of MEMS, especially strength, are reviewed. Four materials commonly used to fabricate MEMS devices are reviewed in this report. These materials are polysilicon, single crystal silicon (SCS), silicon nitride, and silicon carbide.

Probabilistic Weibull behavior and mechanical properties of MEMS brittle materials

Despite great advancements in thin-film growth and deposition techniques, determination of the residual stress and Youngs modulus for thin films has continued to be a challenge. The bulge test is a...

G.F. Cardinale

Papers

Fracture strength and biaxial modulus measurement of plasma silicon nitride films