Certain exemplary embodiments can provide a composition, system, machine, device, manufacture, circuit, and/or user interface adapted for, and/or a method and/or machine-readable medium comprising machine-implementable instructions for, activities that can comprise, after removing a cast device from a stack-lamination-derived mold, said cast device formed from a molding composition, applying a desired shape to said cast device to form a shaped cast device, said molding composition comprising: a ceramic composition comprising silica; an cycloaliphatic epoxy binder composition, said cycloaliphatic epoxy binder composition present in said molding composition in an amount up to 30% by weight of said molding composition; a silicone composition comprising a siloxane resin, said silicone composition present in said molding composition in an amount up to 30% by weight of said molding composition; and a solvent composition adapted to dissolve said cycloaliphatic epoxy binder composition and said silicone composition.

Systems, devices, and/or methods for manufacturing castings

In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabricated on planar or nonplanar surfaces through use of a series of production casting processes and intermediate molds. The use of precision stack lamination can allow the fabrication of high aspect ratio structures. Moreover, via certain molding and/or casting materials, molds having cavities with protruding undercuts also can be fabricated. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. This abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Methods for manufacturing three-dimensional devices and devices created thereby

Certain exemplary embodiments of the present invention comprise a device comprising a cast collimator derived from a metallic foil stack lamination mold, said collimator defining a feature adapted to contain a plurality of radiation detection elements. In certain embodiments, the collimator can define a feature adapted to contain a plurality of radiation detection elements, such as scintillators. Certain exemplary embodiments of the present invention comprise a device comprising a cast component derived from a metallic foil stack lamination mold. In various exemplary embodiments, the cast components can be a mechanical, electrical, electronic, optical, fluidic, biomedical, and/or biotechnological component. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. This abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Devices, methods, and systems involving castings

The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Printed circuit board and manufacturing method thereof

In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

Low-loss interface

A durable, broad-band low insertion loss RF feedthrough is formed of a straight conductor (5) centrally supported by, hermetically sealed to and axially extending through the center of a strong, rigid, impervious ceramic disk (3). The ceramic disk is hermetically sealed, directly or indirectly, to the metal barrier (11) through which the feedthrough is to propagate RF energy. The new ferrule and ferrule-less ceramic metal RF feedthroughs avoid the use of glass, conventional in existing feedthroughs. The novel feedthrough serves as the principal element of a microwave microstrip line to waveguide transition.

Millimeter wave ceramic-metal feedthroughs

A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansion. Friction welding also produces a very small heat affected zone, while brazing, soldering and other types of welding produce large heat affected zones which can cause annealing problems. The aluminum package is easy to machine, light in weight and provides good heat dissipation for the hybrid microcircuits in the package.

Hermetically sealed aluminum package for hybrid microcircuits

A semiconductor laser diode array including a plurality of laser diode bars, each carried by a submount and forming a subassembly. Each subassembly is separated by a flexible or compliant electrically conductive spacer. All connections within the array are by way of a non-fluxed solder, that may be hard and/or soft, reflowed in a non-oxidizing atmosphere in a simple mechanical stack fixture to create nearly void-free solder joints with relatively high thermal integrity and electrical conductivity. Flexible electrically conductive spacers are disposed between the subassemblies to eliminate tensile stress on the laser diode bars while providing electrical conductivity between subassemblies. The subassemblies are carried by a thermally conductive dielectric substrate, allowing waste heat generated from the bars to be conducted to a cooling device. The invention eliminates known failure modes in interconnections, minimizing tensile strength on the diode arrays, and increasing the useful life of the array.

Low cost high integrity diode laser array

An X-ray collimator grid is formed within a wafer of monocrystalline silicon material by forming a plurality of spaced parallel elongate slots within a planar surface of a silicon crystal wafer, and forming slats of heavy metal in situs within each of said slots, including squeegeeing the heavy metal into the slots, from particles of heavy metal, each said slat gripping the walls of an associated slot

Grid formed with silicon substrate

The module has a housing (12) with a base (20), side walls (22) and a top forming a number of inner surfaces and with side wall openings (26), electrical leads (38) through the openings, a microelectronic chip (14) on the base and connected to the leads, a hydrogen getter element (16) of titanium with an external surface essentially free of oxygen and devices for fixing it to one of the inner surfaces.

Integrated microelectronic module has hydrogen getter element of titanium with external surface essentially free of oxygen and devices for fixing it to one of inner surfaces in housing

George G. Pinneo

Papers

Millimeter wave ceramic-metal feedthroughs

Hermetically sealed aluminum package for hybrid microcircuits

Low cost high integrity diode laser array

Grid formed with silicon substrate

Integrated microelectronic module has hydrogen getter element of titanium with external surface essentially free of oxygen and devices for fixing it to one of inner surfaces in housing