Patent
Hermetically sealed aluminum package for hybrid microcircuits
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TLDR
In this paper, a hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing is presented, which resists the thermal stresses induced by the large difference in their coefficients of thermal expansion.Abstract:
A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansion. Friction welding also produces a very small heat affected zone, while brazing, soldering and other types of welding produce large heat affected zones which can cause annealing problems. The aluminum package is easy to machine, light in weight and provides good heat dissipation for the hybrid microcircuits in the package.read more
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TL;DR: In this article, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as the waveguide is disclosed, which is a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by a waveguide without the use of a dielectric material.
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References
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