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Gregory Henshall

Researcher at Hewlett-Packard

Publications -  16
Citations -  124

Gregory Henshall is an academic researcher from Hewlett-Packard. The author has contributed to research in topics: Deformation (engineering) & Creep. The author has an hindex of 6, co-authored 16 publications receiving 119 citations. Previous affiliations of Gregory Henshall include University of Texas at Austin.

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Journal ArticleDOI

Warm-temperature tensile ductility in Al-Mg alloys

TL;DR: In this paper, several binary and ternary Al alloys containing from 2.8 to 5.5 wt pct Mg were tested in tension at elevated temperatures (200°C to 500°C) over a range of strain rates (10−4 to 2.0 s−1).
Journal ArticleDOI

Ductile-phase toughening in V-V3Si in situ composites

TL;DR: In this paper, the authors describe the room-temperature fracture behavior of ductile-phase-toughened V-V3Si in situ composites that were produced by arc melting (AM), cold-crucible induction melting (IM), and cold-cruscible directional solidification (DS).
ReportDOI

Enhanced tensile ductility of coarse-grain Al-Mg alloys

TL;DR: In this paper, the authors used solute-drag creep processes to obtain enhanced tensile ductility in binary Al-Mg alloys with coarse grain sizes, achieving tensile elongations of up to 325%.
Proceedings Article

Addressing opportunities and risks of pb-free solder alloy alternatives

TL;DR: In this article, the authors present the results of an iNEMI project to address the opportunities and risks of new Pb-free alloy alternatives, and focus areas for closing key gaps are identified.