Thermal management of electronic components with dielectric liquids

A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.

Gas-liquid forced turbulence cooling

The rapid increase in on-chip heat fluxes and package heat density, accompanying the migration to nanoelectronics and 3D chip stacks, has placed thermal management squarely on the critical path for advanced product development. Innovative, cost-effective cooling techniques, combined in a synergetic way with more conventional approaches, must be developed if the benefits of the Moore's Law progression are to be realized. Following a brief discussion of the industry roadmap for IC packaging and review of chip package thermal management options, attention will turn to the application of solidstate thermoelectric refrigeration and the thermal characteristics of direct immersion cooling in dielectric liquids. The presentation will close with a discussion of the research challenges associated with the commercial implementation of on-chip thermoelectric coolers and direct liquid cooling.

Thermal management of on-chip hot spots and 3D chip stacks

Etude analytique et experimentale du transfert de chaleur par ebullition dans l'eau sur une paire de plaques plates, a flux thermiques egaux. Resultats experimentaux pour la temperature de la paroi en fonction de la localisation axiale du flux thermique et de l'espacement des plaques. Modele theorique du debit liquide a travers le canal et correlation de la vitesse du transfert de chaleur des parois du canal

Thermosyphon boiling in vertical channels

A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented. The papers are arranged in twelve categories, and cover the period from 1970-1984, although a majority of the papers listed were published in the last three years.

Bibliography of Heat Transfer in Electronic Equipment

Complete immersion of electronic assemblies, in fluids of appropriately high dielectric strength and low dielectric constant, offers a most promising alternative to conventional thermal control measures. The present study is aimed at providing an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.

H. Schweitzer

Papers

Convective Immersion Cooling of Parallel Vertical Plates