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Huazhong Yang

Researcher at Tsinghua University

Publications -  343
Citations -  6629

Huazhong Yang is an academic researcher from Tsinghua University. The author has contributed to research in topics: Computer science & Deep learning. The author has an hindex of 29, co-authored 304 publications receiving 5307 citations. Previous affiliations of Huazhong Yang include Huawei.

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Proceedings ArticleDOI

Going Deeper with Embedded FPGA Platform for Convolutional Neural Network

TL;DR: This paper presents an in-depth analysis of state-of-the-art CNN models and shows that Convolutional layers are computational-centric and Fully-Connected layers are memory-centric, and proposes a CNN accelerator design on embedded FPGA for Image-Net large-scale image classification.
Proceedings ArticleDOI

ESE: Efficient Speech Recognition Engine with Sparse LSTM on FPGA

TL;DR: The Efficient Speech Recognition Engine (ESE) as discussed by the authors proposes a load-balance-aware pruning method that can compress the LSTM model size by 20x (10x from pruning and 2x from quantization).
Journal ArticleDOI

Angel-Eye: A Complete Design Flow for Mapping CNN Onto Embedded FPGA

TL;DR: This paper proposes Angel-Eye, a programmable and flexible CNN accelerator architecture, together with data quantization strategy and compilation tool, which achieves similar performance and delivers up to better energy efficiency than peer FPGA implementation on the same platform.
Posted Content

ESE: Efficient Speech Recognition Engine with Sparse LSTM on FPGA

TL;DR: This work proposes a load-balance-aware pruning method that can compress the LSTM model size by 20x (10x from pruning and 2x from quantization) with negligible loss of the prediction accuracy, and proposes a scheduler that encodes and partitions the compressed model to multiple PEs for parallelism and schedule the complicated L STM data flow.
Proceedings ArticleDOI

Accurate temperature-dependent integrated circuit leakage power estimation is easy

TL;DR: In this article, the authors show that for typical IC packages and cooling structures, a given amount of heat introduced at any position in the active layer will have similar impact on the average temperature of the layer.