The compelling demand for higher performance and lower power consumption in electronic systems is the main driving force of the electronics industry's quest for devices and/or architectures based on new materials. Here, we provide a review of electronic devices based on two-dimensional materials, outlining their potential as a technological option beyond scaled complementary metal-oxide-semiconductor switches. We focus on the performance limits and advantages of these materials and associated technologies, when exploited for both digital and analog applications, focusing on the main figures of merit needed to meet industry requirements. We also discuss the use of two-dimensional materials as an enabling factor for flexible electronics and provide our perspectives on future developments.

Electronics based on two-dimensional materials

A key question for the microprocessor research and design community is whether scaling multicores will provide the performance and value needed to scale down many more technology generations. To provide a quantitative answer to this question, a comprehensive study that projects the speedup potential of future multicores and examines the underutilization of integration capacity-dark silicon-is timely and crucial.

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Dark Silicon and the End of Multicore Scaling

A discussion of many of the recently implemented features of GAMESS (General Atomic and Molecular Electronic Structure System) and LibCChem (the C++ CPU/GPU library associated with GAMESS) is presented. These features include fragmentation methods such as the fragment molecular orbital, effective fragment potential and effective fragment molecular orbital methods, hybrid MPI/OpenMP approaches to Hartree-Fock, and resolution of the identity second order perturbation theory. Many new coupled cluster theory methods have been implemented in GAMESS, as have multiple levels of density functional/tight binding theory. The role of accelerators, especially graphical processing units, is discussed in the context of the new features of LibCChem, as it is the associated problem of power consumption as the power of computers increases dramatically. The process by which a complex program suite such as GAMESS is maintained and developed is considered. Future developments are briefly summarized.

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Recent developments in the general atomic and molecular electronic structure system.

We develop detailed area and energy models for on-chip interconnection networks and describe tradeoffs in the design of efficient networks for tiled chip multiprocessors. Using these detailed models we investigate how aspects of the network architecture including topology, channel width, routing strategy, and buffer size affect performance and impact area and energy efficiency. We simulate the performance of a variety of on-chip networks designed for tiled chip multiprocessors implemented in an advanced VLSI process and compare area and energy efficiencies estimated from our models. We demonstrate that the introduction of a second parallel network can increase performance while improving efficiency, and evaluate different strategies for distributing traffic over the subnetworks. Drawing on insights from our analysis, we present a concentrated mesh topology with replicated subnetworks and express channels which provides a 24% improvement in area efficiency and a 48% improvement in energy efficiency over other networks evaluated in this study.

http://cva.stanford.edu/publications/2006/jbalfour_ICS.pdf

Design tradeoffs for tiled CMP on-chip networks

Printed electronics enable the fabrication of large-scale, low-cost electronic devices and systems, and thus offer significant possibilities in terms of developing new electronics/optics applications in various fields. Almost all electronic applications require information processing using logic circuits. Hence, realizing the high-speed operation of logic circuits is also important for printed devices. This report summarizes recent progress in the development of printed thin-film transistors (TFTs) and integrated circuits in terms of materials, printing technologies, and applications. The first part of this report gives an overview of the development of functional inks such as semiconductors, electrodes, and dielectrics. The second part discusses high-resolution printing technologies and strategies to enable high-resolution patterning. The main focus of this report is on obtaining printed electrodes with high-resolution patterning and the electrical performance of printed TFTs using such printed electrodes. In the final part, some applications of printed electronics are introduced to exemplify their potential.

Recent Progress in the Development of Printed Thin-Film Transistors and Circuits with High-Resolution Printing Technology.

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Hwa-Nien Yu

Papers

Design Of Ion-implanted MOSFET's with Very Small Physical Dimensions