Showing papers by "Ibro Tabakovic published in 2002"

Composition, Structure, Stress, and Coercivity of Electrodeposited Soft Magnetic CoNiFe Films: Thickness and Substrate Dependence

Abstract: The properties of soft magnetic CoNiFe films electrodeposited in the presence of saccharin and sodium lauryl sulfate additives were studied in terms of their thickness and substrate dependence. Auger depth profile analysis of the elemental composition in CoNife films electrodeposited over different substrates (Pd 00 Ni 10. 1.0 T NiFe.Cu) demonstrate that the average composition at the substrate interface and bulk deposited films remains constant. X-ray diffraction (XRD) measurements reveal the existence of mixed fcc + bcc phase with larger amounts of bcc crystallites near the substrate side of the films, i.e.,at the lower thickness. XRD and transmission electron microscopy measurements revealed a larger grain size at the CoNiFe/substrate interface. The measured average stress is both substrate- and thickness-dependent. The easy-axis coercivity, H c , follows the Neel's relation H c = ct n (t is the thickness and c is a constant). It was found that the value of the exponent n is substrate dependent. Mechanisms related to the coercivity of CoNiFe films deposited ovar different substrates (1.0 T NiFe, Cu, Pd 90 Ni 10 , high magnetic moment CoNiFe) are discussed in terms of material properties of these magnetic films.

Transducing head having improved studs and bond pads to reduce thermal deformation

Abstract: A transducing head formed upon a slider has a transducer, an electrical contact layer, a stud electrically connected to the contact layer, and a bond pad electrically connected to the stud. The electrical contact layer is electrically connected to the transducer. The stud is formed of a material having a coefficient of thermal expansion less than about 1.3 times a coefficient of thermal expansion of a slider material forming the slider. The bond pad has a metallic underlayer and a top layer. The metallic underlayer is formed of a material having a coefficient of thermal expansion less than about 1.1 times the coefficient of thermal expansion of the slider material.

Composition, Structure, Stress, and Coercivity of Electrodeposited Soft Magnetic CoNiFe Films — Thickness and Substrate Dependence.

Abstract: The properties of soft magnetic CoNiFe films electrodeposited in the presence of saccharin and sodium lauryl sulfate additives were studied in terms of their thickness and substrate dependence. Auger depth profile analysis of the elemental composition in CoNife films electrodeposited over different substrates (Pd 00 Ni 10. 1.0 T NiFe.Cu) demonstrate that the average composition at the substrate interface and bulk deposited films remains constant. X-ray diffraction (XRD) measurements reveal the existence of mixed fcc + bcc phase with larger amounts of bcc crystallites near the substrate side of the films, i.e.,at the lower thickness. XRD and transmission electron microscopy measurements revealed a larger grain size at the CoNiFe/substrate interface. The measured average stress is both substrate- and thickness-dependent. The easy-axis coercivity, H c , follows the Neel's relation H c = ct n (t is the thickness and c is a constant). It was found that the value of the exponent n is substrate dependent. Mechanisms related to the coercivity of CoNiFe films deposited ovar different substrates (1.0 T NiFe, Cu, Pd 90 Ni 10 , high magnetic moment CoNiFe) are discussed in terms of material properties of these magnetic films.