A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.

Heat sink for cooling a heat producing element and application

An electronic component cooling apparatus capable of permitting a sufficient amount of air to be fed to an electronic component to be cooled An impeller which includes a plurality of blades for sucking air from one side in an axial direction of a revolving shaft of a motor is fixed on a rotor of the motor A casing having a cylindrical cavity defined therein in which the motor and impeller are received is constructed of a peripheral wall arranged so as to surround the impeller and a closing wall for closing an end of the cavity on the other side in the axial direction The peripheral wall is formed at a portion thereof in proximity to an end thereof on the one side with a lateral discharge port through which air suckedly introduced into the cavity is discharged so that a surrounding portion for surrounding a whole circumference of the impeller is left at a portion of the peripheral wall in proximity to an end on the other side The casing is provided with a spacer means for providing an interval between the casing and an opposite member

Electronic component cooling apparatus

An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body. The chiller circulates the fluid through a chiller and the fluid heat exchanger.

Cooling apparatus for electronic devices

A cooling device mounting a fan unit above a heat sink mounted on a heat-generating element or buried therein, which produces an effective air flow and achieves a uniform cooling action by having the heat sink shown in various shapes. Further, a cooling fan disposed away from the heat sink or to the side of the same is used for effective cooling through an air conduit passage formed by pipes or a cover.

Heat-generating element cooling device

A fan heatsink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly includes a blower mounted on top of a specially shaped heatsink, the heatsink having a truncated hyperbolic shaped central member, with fins radially emanating from the center. The blower draws air in through the area between the fins, up the curved central portion and into the blower assembly where it is then exited out the sides of the fan. The fins may be smooth or textured, straight or curved. The fan heatsink assembly is attached to the device to be cooled. Heat is transferred from the electronic component, into the heat dissipating member where the fan causes air to be drawn up between the fins and along the curved center portion, removing heat from the heat dissipating member and the electronic component.

High performance fan heatsink assembly

A heat sink apparatus for convective cooling of circuit packages or components by direct impinging fluid operation employing a housing having an inlet port and a plurality of radially fluid flow passages communicating with the inlet port with each passage also having an outlet port A fluid deflection member is supported with the housing in line with the inlet port and is provided with a deflection surface adapted to redirect the fluid flow from the inlet port to the air flow passages

Iii. Leo M. Higgins

Papers

Heat sink apparatus