Patent
Heat sink apparatus
TLDR
A heat sink for convective cooling of circuit packages or components by direct impinging fluid operation employing a housing having an inlet port and a plurality of radially fluid flow passages communicating with the inlet with each passage also having an outlet port is described in this article.Abstract:
A heat sink apparatus for convective cooling of circuit packages or components by direct impinging fluid operation employing a housing having an inlet port and a plurality of radially fluid flow passages communicating with the inlet port with each passage also having an outlet port A fluid deflection member is supported with the housing in line with the inlet port and is provided with a deflection surface adapted to redirect the fluid flow from the inlet port to the air flow passagesread more
Citations
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Patent
Heat sink for cooling a heat producing element and application
Tadashi Katsui,Katsuhiko Nakata,Takeshi Koga,Tadanobu Matsumura,Yoshimi Tanaka,Yasuaki Sugimoto,Takashi Kitahara,Takayuki Horinishi +7 more
TL;DR: In this paper, a heat sink mounted on a heat producing element for cooling the heat-consuming element attached on the printed board of the electronic apparatus is described, where the heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly.
Patent
Electronic component cooling apparatus
TL;DR: An electronic component cooling apparatus capable of permitting a sufficient amount of air to be fed to an electronic component to be cooled is described in this paper, where an impeller which includes a plurality of blades for sucking air from one side in an axial direction of a rotating shaft of a motor is fixed on a rotor of the motor.
Patent
Cooling apparatus for electronic devices
TL;DR: In this article, the authors describe an apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump, which transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated.
Patent
Heat-generating element cooling device
TL;DR: A cooling device mounting a fan unit above a heat sink mounted on a heat-generating element or buried therein, which produces an effective air flow and achieves a uniform cooling action by having the heat sink shown in various shapes is described in this paper.
Patent
High performance fan heatsink assembly
Charles R. Barker,Richard E. Olson,Stephen E. Lindquist,Massimo Hartsarich,David A. Cease,Robert S. Sobolewski +5 more
TL;DR: In this paper, a blower is mounted on top of a specially shaped heatsink, the heatsink having a truncated hyperbolic shaped central member, with fins radially emanating from the center.
References
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Patent
Staggered radial-fin heat sink device for integrated circuit package
TL;DR: A radial fin heat sink as discussed by the authors comprises a pattern of variable lengths which follow in succession from a major length to a minor length to an intermediate length which pattern repeats around the periphery of the spreader plate.
Patent
Aerodynamically enhanced heat sink
TL;DR: In this article, an aerodynamically enhanced heat sink is disclosed, which heat sink includes a plurality of metallic pins each having one end thereof affixed to the integrated circuit package and the second end thereof being disposed for heat dissipation.
Patent
Cooling system for semiconductor modules
TL;DR: In this article, a cooling structure for a semiconductor package wherein the cooling fluid is circulated over the cooling fins over short distances is presented, where the fluid flow is separated into multiple flow streams, passed over the fins for short distances and exhausted.
Patent
Air-cooled hybrid electronic package
TL;DR: In this article, an air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metallized ceramic modules.
Patent
Heat transfer device employing fins in a fluid stream
TL;DR: In this paper, a heat exchanger comprises a device coupled in heat exchanging relation with a fluid stream by means of an arcuate array of radially directed, circumferentially spaced, thermally conductive fins with the mean plane of each fin being generally parallel of the axis of revolution of the arcuate arrays.