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Jeet P. Patil

Researcher at Shri Guru Gobind Singhji Institute of Engineering and Technology

Publications -  12
Citations -  33

Jeet P. Patil is an academic researcher from Shri Guru Gobind Singhji Institute of Engineering and Technology. The author has contributed to research in topics: Thermoforming & Engineering. The author has an hindex of 2, co-authored 5 publications receiving 7 citations.

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Investigation of temperature distribution and solidification morphology in multilayered directed energy deposition of Al-0.5Sc-0.5Si alloy

TL;DR: In this paper , the temperature distribution, geometry and size of the melt pool, and solidification parameters were computed using the heat transfer and material flow model for the directed energy deposition process.
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A numerical approach on achieving uniform thickness distribution in pressure thermoforming

TL;DR: In this article, the deformation process of a PMMA sheet into a hemispherical dome using pressure thermoforming is numerically analyzed and the concept of provision of initial thickness distribution to the sheet is proposed.
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Prediction of Thrust Force and Torque in Drilling of Glass Fiber Reinforced Plastic Using Mechanistic Force Model Approach

TL;DR: In this article, a mechanistic approach is proposed to predict thrust forces and torque for cutting speed and feed rate combinations in a GFRP drilling process, which is validated for the drill point angle, drill diameter and primary cutting edge of drill bit for a wide range of machining conditions.
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Contact Analysis for Contact Thermoforming of PMMA Sheet

TL;DR: In this article, the effect of change in the contact conditions on product thickness was investigated considering poly(methyl methacrylate) as the sheet material and stainless steel 304 as the punch material.
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Transient thermal analysis of close pressure thermoforming process

TL;DR: In this paper, the thermal state of a polyamideamide mold (PMMA) sheet during conversion into a hemispherical dome using a closed pressure thermoforming setup is investigated numerically.