J
Jian Dih Jeng
Researcher at Industrial Technology Research Institute
Publications - 2
Citations - 27
Jian Dih Jeng is an academic researcher from Industrial Technology Research Institute. The author has contributed to research in topics: Die (integrated circuit) & Paddle. The author has an hindex of 2, co-authored 2 publications receiving 27 citations.
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Patent
Heat sink bonded to a die paddle having at least one aperture
Jian Dih Jeng,Hsing Seng Wang +1 more
TL;DR: In this article, a method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture there through, positioning a heat sinks abutting the bottom surface of the die paddle, and then pressing an integrated-circuit die against the top surface with an adhesive material sandwiched therein between such that the adhesive flows through at least 1 aperture in the die paddles portion to bond the integrated circuit dies and the heat sink together.
Patent
Method for bonding a heat sink to a die paddle
Jian Dih Jeng,Hsing Seng Wang +1 more
TL;DR: In this paper, a method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture there through, positioning a heat sinks abutting the bottom surface of the die paddle, and then pressing an integrated-circuit die against the top surface with an adhesive material sandwiched therein between such that the adhesive flows through at least 1 aperture in the die paddles portion to bond the integrated circuit dies and the heat sink together.