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Jin Dai

Researcher at Royal Institute of Technology

Publications -  17
Citations -  689

Jin Dai is an academic researcher from Royal Institute of Technology. The author has contributed to research in topics: Thermal radiation & Surface plasmon polariton. The author has an hindex of 12, co-authored 17 publications receiving 568 citations. Previous affiliations of Jin Dai include Purdue University.

Papers
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Broadband near-infrared metamaterial absorbers utilizing highly lossy metals

TL;DR: This work proposes and experimentally demonstrates thin, broadband, polarization-insensitive and omnidirectional absorbers working in the near-infrared range and chooses titanium instead of the commonly used gold to construct nano-disk arrays.
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Lithography-free broadband visible light absorber based on a mono-layer of gold nanoparticles

TL;DR: In this paper, a large area, optically opaque plasmonic absorber was demonstrated to absorb 95% of visible light with an effective thickness of less than 150 nm.
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Near field thermal memory based on radiative phase bistability of VO2

TL;DR: In this paper, a near-field memory device based on the radiative bistability effect in the system of two closely separated parallel plates of SiO2 and VO2 which exchange heat by thermal radiation in vacuum.
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Enhanced near-field radiative heat transfer between corrugated metal plates: Role of spoof surface plasmon polaritons

TL;DR: Pendry et al. as discussed by the authors demonstrate with the finite-difference time-domain method that radiative heat transfer between two parallel gold plates can be significantly enhanced by engraving periodic grooves with a subwavelength width on the plate surfaces.
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Light absorber based on nano-spheres on a substrate reflector

TL;DR: It is identified that the high-absorption resonance is mainly due to gap plasmon (coupled through particle bodies) when the separation between neighboring nano-spheres is small enough, such as close to 1 nm; at larger particle separations, the resonance is dominated by particle dipoles (couple through the host dielectric).