Technology roadmapping—A planning framework for evolution and revolution

The seemingly unshakeable accuracy of Moore's law - which states that the speed of computers; as measured by the number of transistors that can be placed on a single chip, will double every year or two - has been credited with being the engine of the electronics revolution, and is regarded as the premier example of a self-fulfilling prophecy and technological trajectory in both the academic and popular press. Although many factors have kept Moore's law as an industry benchmark, it is the entry of foreign competition that seems to have played a critical role in maintaining the pace of Moore's law in the early VLSI transition. Many different kinds of chips used many competing logic families. DRAMs and microprocessors became critical to the semiconductor industry, yet were unknown during the original formulation of Moore's law

Establishing Moore's Law

Managing New Industry Creation: Global Knowledge Formation And Entrepreneurship In High Technology

The dissolution processes and subsequent intermetallic reactions between high tin solder bump alloys and Cu‐ or Ni‐based UBM‐metallisations were investigated both theoretically and experimentally. The results showed that when the Cu UBM layer is used together with eutectic or higher Sn‐based solder alloys the dissolution of Cu and the rate of the Cu6Sn5 formation is too high for reliable interconnections. On the contrary, Ni provides feasible solution for UBM/high tin solder applications. Although there is strong chemical interaction between nickel and high Sn solder bump alloys, the dissolution and subsequent Ni3Sn4 layer growth rates are very low. Thus, a thin Ni layer can sustain interactions with high Sn liquid as well as solid solders during high temperature use. On the basis of the results obtained flip chip bonding with Ni‐based UBM structures provides a viable interconnection solution for reliable fine‐pitch applications.

Effect of dissolution and intermetallic formation on the reliability of FC joints

Human-centric product conceptualization using a design space framework

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

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Electronic manufacturing and packaging in Japan

Global competition in the electronics industry is offering unprecedented challenges to the industrial sector. Product lifecycles are shortening, development cycle times are decreasing, profit margins are declining, and new technology is readily available to anyone who aggressively pursues it. Japan has targeted electronics as an industry vital to its industrial success, and can, to a large degree, declare victory-particularly in the high-volume, low-cost electronic assembly industry. The question that the JTEC Electronic Packaging Panel was asked to answer was, why?. >

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JTEC panel report on electronic manufacturing and packaging in Japan

JTEC Panel report on electronic manufacturing and packaging in Japan

In the consumer electronics industry, precision processing technology is the basis for enhancing product functions and for minimizing components and end products. Throughout Japan, manufacturing technology is seen as critical to the production and assembly of advanced products. While its population has increased less than 30 percent over twenty-five years, Japan's gross national product has increase thirtyfold; this growth has resulted in large part from rapid replacement of manual operations with innovative, high-speed, large-scale, continuously running, complex machines that process a growing number of miniaturized components. The JTEC panel found that introduction of next-generation electronics products in Japan goes hand-in-hand with introduction of new and improved production equipment. In the panel's judgment, Japan's advanced process technologies and equipment development and its highly automated factories are crucial elements of its domination of the consumer electronics marketplace - and Japan's expertise in manufacturing consumer electronics products gives it potentially unapproachable process expertise in all electronics markets.

John A. Kukowski

Papers

Electronic manufacturing and packaging in Japan

JTEC panel report on electronic manufacturing and packaging in Japan

JTEC Panel report on electronic manufacturing and packaging in Japan

Electronics manufacturing and assembly in Japan