An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

The resistive switching mechanism of 20- to 57-nm-thick TiO2 thin films grown by atomic-layer deposition was studied by current-voltage measurements and conductive atomic force microscopy. Electric pulse-induced resistance switching was repetitively (> a few hundred times) observed with a resistance ratio ⪢102. Both the low- and high-resistance states showed linear log current versus log voltage graphs with a slope of 1 in the low-voltage region where switching did not occur. The thermal stability of both conduction states was also studied. Atomic force microscopy studies under atmosphere and high-vacuum conditions showed that resistance switching is closely related to the formation and elimination of conducting spots. The conducting spots of the low-resistance state have a few tens times higher conductivity than those of the high-resistance state and their density is also a few tens times higher which results in a ∼103 times larger overall conductivity. An interesting finding was that the area where the ...

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Resistive switching mechanism of TiO2 thin films grown by atomic-layer deposition

The resistance switching behaviour of several materials has recently attracted considerable attention for its application in non-volatile memory (NVM) devices, popularly described as resistive random access memories (RRAMs). RRAM is a type of NVM that uses a material(s) that changes the resistance when a voltage is applied. Resistive switching phenomena have been observed in many oxides: (i) binary transition metal oxides (TMOs), e.g. TiO(2), Cr(2)O(3), FeO(x) and NiO; (ii) perovskite-type complex TMOs that are variously functional, paraelectric, ferroelectric, multiferroic and magnetic, e.g. (Ba,Sr)TiO(3), Pb(Zr(x) Ti(1-x))O(3), BiFeO(3) and Pr(x)Ca(1-x)MnO(3); (iii) large band gap high-k dielectrics, e.g. Al(2)O(3) and Gd(2)O(3); (iv) graphene oxides. In the non-oxide category, higher chalcogenides are front runners, e.g. In(2)Se(3) and In(2)Te(3). Hence, the number of materials showing this technologically interesting behaviour for information storage is enormous. Resistive switching in these materials can form the basis for the next generation of NVM, i.e. RRAM, when current semiconductor memory technology reaches its limit in terms of density. RRAMs may be the high-density and low-cost NVMs of the future. A review on this topic is of importance to focus concentration on the most promising materials to accelerate application into the semiconductor industry. This review is a small effort to realize the ambitious goal of RRAMs. Its basic focus is on resistive switching in various materials with particular emphasis on binary TMOs. It also addresses the current understanding of resistive switching behaviour. Moreover, a brief comparison between RRAMs and memristors is included. The review ends with the current status of RRAMs in terms of stability, scalability and switching speed, which are three important aspects of integration onto semiconductors.

https://iopscience.iop.org/article/10.1088/0034-4885/75/7/076502/pdf

Emerging memories: resistive switching mechanisms and current status.

Issues in the circuitry, integration, and material properties of the two-dimensional (2D) and three-dimensional (3D) crossbar array (CBA)-type resistance switching memories are described. Two important quantitative guidelines for the memory integration are provided with respect to the required numbers of signal wires and sneak current paths. The advantage of 3D CBAs over 2D CBAs (i.e., the decrease in effect memory cell size) can be exploited only under certain limited conditions due to the increased area and layout complexity of the periphery circuits. The sneak current problem can be mitigated by the adoption of different voltage application schemes and various selection devices. These have critical correlations, however, and depend on the involved types of resistance switching memory. The problem is quantitatively dealt with using the generalized equation for the overall resistance of the parasitic current paths. Atomic layer deposition is discussed in detail as the most feasible fabrication process of 3D CBAs because it can provide the device with the necessary conformality and atomic-level accuracy in thickness control. Other subsidiary issues related to the line resistance, maximum available current, and fabrication technologies are also reviewed. Finally, a summary and outlook on various other applications of 3D CBAs are provided.

A Review of Three-Dimensional Resistive Switching Cross-Bar Array Memories from the Integration and Materials Property Points of View

This review stands in the larger framework of functional materials by focussing on heterostructures of rare-earth nickelates, described by the chemical formula RNiO3 where R is a trivalent rare-earth R  =  La, Pr, Nd, Sm, …, Lu. Nickelates are characterized by a rich phase diagram of structural and physical properties and serve as a benchmark for the physics of phase transitions in correlated oxides where electron-lattice coupling plays a key role. Much of the recent interest in nickelates concerns heterostructures, that is single layers of thin film, multilayers or superlattices, with the general objective of modulating their physical properties through strain control, confinement or interface effects. We will discuss the extensive studies on nickelate heterostructures as well as outline different approaches to tuning and controlling their physical properties and, finally, review application concepts for future devices.

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Rare-earth nickelates RNiO3: thin films and heterostructures.

A thin film capacitor comprising an insulating substrate, a capacitor structure located on the substrate, the capacitor structure having a dielectric layer sandwiched between a lower electrode layer and an upper electrode layer, and conductor members respectively connected to the lower electrode layer and the upper electrode layer, wherein at least the dielectric layer has a side face having a sufficient slope for preventing the short circuit of the upper electrode layer with the lower electrode layer through the conductor member. A method of manufacturing such a thin film capacitor is also disclosed.

Thin film capacitor and method of manufacturing the same

The interaction of water and carbon dioxide with nanostructured epitaxial (Ba,Sr)TiO3(001) thin film and bulk single crystal SrTiO3(001) surfaces was studied using x-ray photoemission spectroscopy (XPS), thermal desorption spectroscopy (TDS), and density functional theory (DFT). On both surfaces, XPS and TDS indicate D2O and CO2 chemisorb at room temperature with broad thermal desorption peaks (423–723 K) and a peak desorption temperature near 573 K. A comparison of thermal desorption Redhead activation energies to adsorption energies calculated using DFT indicates that defect surface sites are important for the observed strong adsorbate-surface reactivity. Numerical calculations of the competetive adsorption/desorption equilibria for H2O and CO2 on SrTiO3(001) surfaces show that for typical atmospheric concentrations of 0.038% carbon dioxide and 0.247% water vapor the surfaces are covered to a large extent with both adsorbates. The high desorption temperature indicates that these adsorbates have the pote...

Chemisorption of water and carbon dioxide on nanostructured BaTiO3–SrTiO3(001) surfaces

The importance of interface and bulk transport mechanisms on the leakage current of high dielectric constant thin film capacitors is examined by deriving an equation for the J–VA characteristic of a capacitor that includes the transport mechanisms of thermionic emission (TE), thermionic field emission (TFE), and carrier drift–diffusion (DD) The current is controlled by the slowest of three effective velocity parameters v1md, vD, and ṽ2dm characterizing electron injection into the dielectric at the cathode by TE and TFE, carrier DD in the film bulk, and electron ejection from the dielectric at the anode by TE and TFE, respectively The effective velocity parameters are evaluated for a Pt/BST/Pt thin film capacitor that has been exposed to forming gas and it is shown that the dominant transport mechanism is interface limited TFE from the cathode with negligible influence of carrier transport by DD in the film bulk Implications of these results on existing transport calculations for high dielectric constan

Investigation of the importance of interface and bulk limited transport mechanisms on the leakage current of high dielectric constant thin film capacitors

In one aspect of the invention, in a thin layer capacitor element comprising a capacitor having a dielectric layer made of a metal oxide and a protective insulating layer made of a resin material, a barrier layer made of a non-conductive inorganic material is provided between the capacitor and the protective insulating layer. In another aspect of the invention, a thin layer capacitor element is constituted so that a capacitor structure is covered with at least one protective insulating layer composed of a cured resin, the cured resin being formed from at least one resin precursor selected from the group consisting of thermosetting resins, photosetting resins and thermoplastic resins.

John David Baniecki

Papers

Thin film capacitor and method of manufacturing the same

Chemisorption of water and carbon dioxide on nanostructured BaTiO3–SrTiO3(001) surfaces

Investigation of the importance of interface and bulk limited transport mechanisms on the leakage current of high dielectric constant thin film capacitors

Layer capacitor element and production process as well as electronic device

Photoemission and quantum chemical study of SrTiO 3 (001) surfaces and their interaction with CO 2