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John H. Lau

Researcher at ASM International

Publications -  378
Citations -  9659

John H. Lau is an academic researcher from ASM International. The author has contributed to research in topics: Flip chip & Soldering. The author has an hindex of 44, co-authored 361 publications receiving 8540 citations. Previous affiliations of John H. Lau include Agilent Technologies & Agency for Science, Technology and Research.

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

John H. Lau, +1 more
TL;DR: Reliability testing and data analysis failure analysis and root cause identification design for reliability solder joint reliability of BGA assemblies solder joints reliability of CSP assembly solder joints of flip chip assemblies.
Book

Ball Grid Array Technology

John H. Lau
TL;DR: In this article, the authors introduce BGA technology ceramic substrates for BGA packages BT substrates and plastic BGA assembly inspection of BGA tests and sockets infrastructure to support BGA manufacturing.
Journal ArticleDOI

Overview and outlook of through‐silicon via (TSV) and 3D integrations

TL;DR: In this paper, a generic, low-cost and thermal-enhanced 3D IC integration SiP with a passive interposer has been proposed for high performance applications, which uses chip-to-chip interconnections through a passive TSV interposers in a SiP format with excellent thermal management.
BookDOI

Solder Joint Reliability

John H. Lau