J
John H. Lau
Researcher at ASM International
Publications - 378
Citations - 9659
John H. Lau is an academic researcher from ASM International. The author has contributed to research in topics: Flip chip & Soldering. The author has an hindex of 44, co-authored 361 publications receiving 8540 citations. Previous affiliations of John H. Lau include Agilent Technologies & Agency for Science, Technology and Research.
Papers
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Journal ArticleDOI
Discovery of Seven Novel Mammalian and Avian Coronaviruses in the Genus Deltacoronavirus Supports Bat Coronaviruses as the Gene Source of Alphacoronavirus and Betacoronavirus and Avian Coronaviruses as the Gene Source of Gammacoronavirus and Deltacoronavirus
Patrick C. Y. Woo,Susanna K. P. Lau,Carol S. F. Lam,Candy C. Y. Lau,Alan K.L. Tsang,John H. Lau,Ru Bai,Jade L. L. Teng,Chris C. C. Tsang,Ming Wang,Bo-Jian Zheng,Kwok-Hung Chan,Kwok-Yung Yuen +12 more
TL;DR: It appears that bats and birds, the warm blooded flying vertebrates, are ideal hosts for the coronavirus gene source and birds for Gammacoronavirus and Deltacor onavirus, to fuel coronav virus evolution and dissemination.
Book
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
John H. Lau,Yi-Hsin Pao +1 more
TL;DR: Reliability testing and data analysis failure analysis and root cause identification design for reliability solder joint reliability of BGA assemblies solder joints reliability of CSP assembly solder joints of flip chip assemblies.
Book
Ball Grid Array Technology
TL;DR: In this article, the authors introduce BGA technology ceramic substrates for BGA packages BT substrates and plastic BGA assembly inspection of BGA tests and sockets infrastructure to support BGA manufacturing.
Journal ArticleDOI
Overview and outlook of through‐silicon via (TSV) and 3D integrations
TL;DR: In this paper, a generic, low-cost and thermal-enhanced 3D IC integration SiP with a passive interposer has been proposed for high performance applications, which uses chip-to-chip interconnections through a passive TSV interposers in a SiP format with excellent thermal management.