J
John W. Lewis
Researcher at IBM
Publications - 4
Citations - 234
John W. Lewis is an academic researcher from IBM. The author has contributed to research in topics: Wafer & Etching (microfabrication). The author has an hindex of 4, co-authored 4 publications receiving 234 citations.
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Patent
Wafer lift assembly
TL;DR: In this article, a wafer lift assembly including an RF shunt is provided, where an insulating rim is connected to a powered lift cylinder via a conductive screw, and the head of the screw is recessed below a top surface of the rim.
Patent
RF Coupling techniques
TL;DR: An improved reactive ion plasma etching apparatus having an improved electrode, for holding the product, such as a semiconductor wafer, to be etched, provided with a plurality of apertures into which different tailored product holders are inserted so as to alter the plasma over each holder and provide more uniform etching of the product in the holder regardless of its position on the electrode.
Patent
Wafer identification mark
Brian C. Barker,Raymond J. Bunkofske,John Z. Colt,Percy G Hartswick,John W. Lewis,Nancy T. Pascoe +5 more
TL;DR: In this article, a semiconductor wafer including a plurality of pits in the wafer is shown to have an information-providing pattern and is readable after completion of processing.
Patent
Plasma etching apparatus
TL;DR: A reactive ion plasma etching apparatus having an electrode for holding the product, such as a semiconductor wafer, to be etched, provided with a plurality of apertures (15, 15a, 15b) into which different tailored product holders are inserted so as to alter the plasma over each holder and provide more uniform etching of the product in the holder regardless of its position on the electrode as discussed by the authors.