An interference modulator (Imod) incorporates anti-reflection coatings and/or micro-fabricated supplemental lighting sources. An efficient drive scheme is provided for matrix addressed arrays of IMods or other micromechanical devices. An improved color scheme provides greater flexibility. Electronic hardware can be field reconfigured to accommodate different display formats and/or application functions. An IMod's electromechanical behavior can be decoupled from its optical behavior. An improved actuation means is provided, some one of which may be hidden from view. An IMod or IMod array is fabricated and used in conjunction with a MEMS switch or switch array. An IMod can be used for optical switching and modulation. Some IMods incorporate 2-D and 3-D photonic structures. A variety of applications for the modulation of light are discussed. A MEMS manufacturing and packaging approach is provided based on a continuous web fed process. IMods can be used as test structures for the evaluation of residual stress in deposited materials.

Photonic mems and structures

The techniques and technologies currently being investigated to detect weapons and contraband concealed on persons under clothing are reviewed. The basic phenomenology of the atmosphere and materials that must be understood in order to realize such a system are discussed. The component issues and architectural designs needed to realize systems are outlined. Some conclusions with respect to further technology developments are presented.

Standoff Detection of Weapons and Contraband in the 100 GHz to 1 THz Region

Apparatus, systems and techniques for using composite left and right handed (CRLH) metamaterial (MTM) structure antenna elements and arrays to provide radiation pattern shaping and beam switching.

Metamaterial antenna arrays with radiation pattern shaping and beam switching

An interferometric modulator manufactured according to a particular set of processing parameters may have a non-zero offset voltage. A process has been developed for modifying the processing parameters to shift the non-zero offset voltage closer to zero. For example, the process may involve identifying a set of processing parameters for manufacturing an interferometric modulator that results in a non-zero offset voltage for the interferometric modulator. The set of processing parameters may then be modified to shift the non-zero offset voltage closer to zero. For example, modifying the set of processing parameters may involve modifying one or more deposition parameters used to make the interferometric modulator, applying a current (e.g., a counteracting current) to the interferometric modulator, and/or annealing the interferometric modulator. Interferometric modulators made according to the set of modified processing parameters may have improved performance and/or simpler drive schemes.

Process for modifying offset voltage characteristics of an interferometric modulator

A plurality of antenna elements on a dielectric substrate are adapted to launch or receive electromagnetic waves in or from a direction substantially away from either a convex or concave edge of the dielectric substrate, wherein at least two of the antenna elements operate in different directions. Slotlines of tapered-slot endfire antennas in a first conductive layer of a first side of the dielectric substrate are coupled to microstrip lines of a second conductive layer on the second side of the dielectric substrate. A bi-conical reflector, conformal cylindrical dielectric lens, or discrete lens array improves the H-plane radiation pattern. Dipole or Yagi-Uda antenna elements on the conductive layer of the dielectric substrate can be used in cooperation with associated reflective elements, either alone or in combination with a corner-reflector of conductive plates attached to the conductive layers proximate to the endfire antenna elements.

Multi-beam antenna

Methods for the design and fabrication of micro-electro-mechanical switches are disclosed. Two different switch designs with three different switch fabrication techniques are presented for a total of six switch structures. Each switch has a multiple-layer armature with a suspended biasing electrode and a conducting transmission line affixed to the structural layer of the armature. A conducting dimple is connected to the conducting line to provide a reliable region of contact for the switch. The switch is fabricated using silicon nitride as the armature structural layer and silicon dioxide as the sacrificial layer supporting the armature during fabrication. Hydrofluoric acid is used to remove the silicon dioxide layer with post-processing in a critical point dryer to increase yield.

Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications

Low cost millimeter wave imagers using two-dimensional focal plane arrays based on backward tunneling diode (BTD) detectors. Two-dimensional focal arrays of BTD detectors are used as focal plane arrays in imagers. High responsivity of BTD detectors near zero bias results in low noise detectors that alleviate the need for expensive and heat generating low noise amplifiers or Dicke switches in the imager. BTD detectors are installed on a printed circuit board using flip chip packaging technology and horn antennas direct the waves toward the flip chip including the BTD detectors. The assembly of the horn antennas, flip chips, printed circuit board substrate, and interconnects together work as an imaging sensor. Corrugated surfaces of the components prevent re-radiation of the incident waves.

Low cost millimeter wave imager

An antenna array comprises a substrate; a plurality of projecting, tapering structures disposed in an array and attached to a first major surface of said substrate, the plurality of projecting, tapering structures defining a plurality of waveguides therebetween; and a plurality of box-shaped structures disposed in an array and attached to a second major surface of the substrate, the plurality of box-shaped structures defining a plurality of waveguides therebetween, the plurality of waveguides defined by the plurality of projecting, tapering structures aligning with the plurality of waveguides defined by the plurality of box-shaped structures. The substrate includes a plurality of probes for feeding the plurality waveguides.

Wideband antenna array

Disclosed is an antenna system including a Luneberg Lens having a spherically shaped outer surface and a spherically shaped focal surface spaced from its outer surface with a plurality of patch antenna elements disposed along the focal surface of the Luneberg Lens; and a power combiner for combining signals received by said plurality of patch antenna elements. The disclosed antenna system may be used a part of a robust GPS system having a plurality of GPS satellites each transmitting a GPS signal; a plurality of airborne GPS platforms, each GPS platform including a GPS transmitter for transmitting its own GPS signal, the GPS signals being transmitted from the plurality of airborne GPS platforms being differentiated from the GPS signals transmitted by visible GPS satellites; and at least one terrestrially located GPS receiver for receiving the GPS signals transmitted by visible ones of the GPS satellites and by visible ones of said airborne GPS platforms.

Antenna system and RF signal interference abatement method

An analytical model and supporting measured data are presented for a preamplified W-band radiometer with a zero-bias detector appropriate for commercial millimeter-wave imaging cameras. Basic radiometer parameters, including RF bandwidth, are computed directly from simple low-frequency measurements and compare well with those obtained from RF measurements. A detailed analytical model shows how radiometer performance depends on internal component parameters, such as low-noise amplifier gain, noise factor, reflection coefficient, detector responsivity, etc. The measurements suggest that performance is sufficient for operation without a Dicke switch or mechanical chopping. A measured noise equivalent temperature difference of 0.45 K was obtained, assuming a single sensor is scanned across a focal plane, forming 32 pixels with 3.125-ms integration time per pixel. This sensitivity is considered sufficient by commercial manufacturers to obtain quality images in low-contrast (e.g., indoor) environments.

Jonathan J. Lynch

Papers

Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications

Low cost millimeter wave imager

Wideband antenna array

Antenna system and RF signal interference abatement method

Passive Millimeter-Wave Imaging Module With Preamplified Zero-Bias Detection