Showing papers by "Joseph Anthony Abys published in 1997"
Patent•
19 Nov 1997
TL;DR: In this article, an aqueous electroplating bath for the electrodeposition of palladium alloys in a mixed ligand system was proposed, in which a first ligand operates to form a complex of palladium and a second ligand functions to form another metal which brings the plating potentials of the two metals closer together.
Abstract: An aqueous electroplating bath for the electrodeposition of palladium alloys in a mixed ligand system. A first ligand operates to form a complex of palladium and a second ligand functions to form a complex of another metal which brings the plating potentials of the two metals closer together. Palladium and the alloying metal thus exist as complexes with different structures.
25 citations
Patent•
27 May 1997TL;DR: In this paper, a conformable nickel coating was proposed for bending a lead frame to an angle of at least about 82 degrees with a bend radius of about 100 μm to about 300 μm.
Abstract: A process for depositing a conformable nickel coating on a lead frame is disclosed. The metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least about 82 degrees with a bend radius of about 100 μm to about 300 μm. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 μm. The conformable nickel coating is formed using an electroplating bath containing nickel as a nickel complex, a nickel salt, a buffer and a fluorochemical wetting agent.
4 citations
Journal Article•
TL;DR: In this paper, the porosity of electroplated deposits is known to be related to certain substrate conditions, such as inclusions, purity, and particularly, roughness, and a comparison of porosity was made between electrodeposited palladium, palladium-nickel (80/20), and cobalt hard gold over varying degrees of substrate roughness and deposit thickness.
Abstract: The porosity of electroplated deposits is known to be related to certain substrate conditions, such as inclusions, purity, and particularly, roughness. As few commercial substrates are finely polished, a means of understanding the impact of surface finish was desired. A comparison of porosity was made between electrodeposited palladium, palladium-nickel (80/20) and cobalt hard gold over varying degrees of substrate roughness and deposit thicknesses. OFHC copper disks were abraded to various degrees of roughness from 0.05 to 1.0 μm (center line average). These samples were then plated with individual layers of the metal of interest under controlled, highspeed conditions using a Rotating Disk Electrode. Thicknesses ranged from 0.25 to 2.0 μm. The plating conditions were determined previously in order to produce minimal levels of intrinsic porosity from each of these specific chemistries. Porosity was determined by subjecting the plated disks to sulfurous acid vapor according to ASTM B799-88 (Standard Test Method for Porosity in Gold and Palladium Coatings by Sulfurous Acid Vapor) and subsequently to vapors of ammonium sulfide. The pore corrosion was tallied and reported as a percentage of salt-covered area for the various conditions.
3 citations
Patent•
26 Mar 1997
TL;DR: In this article, an ultra-thin composite of noble metal layers on a nickel surface is proposed, which ranges from 2.5 to 11 microinches in thickness and includes in succession from nickel, a 0.5-3.5 microinches of palladium or gold strike, and a 0 to 1 microinch thick gold layer.
Abstract: This problem has been solved by providing an ultra-thin composite of noble metal layers on a nickel surface. The composite ranges from 2.5 to 11 microinches in thickness and includes in succession from nickel, a 0.5 to 3.5 microinches of palladium or gold strike, a 0.5 to 5 microinches thick palladium-nickel alloy layer having 10 to 90 weight percent nickel by weight of the alloy, a 0.5 to 5 microinches thick palladium layer, and a 0 to 1 microinch thick gold layer. The gold layer is being used whenever it is desirable to achieve high speed of solder wetting, relative to the speed of solder wetting of palladium. Viable ultra-thin coatings are most effectively obtained by deposition of the layers in a reel-to-reel metal deposition process.
1 citations
Patent•
AT&T1
TL;DR: In this paper, an instrument and method for measuring the throwing power (TP) of electroplating solutions under well-defined hydrodynamic conditions are described, including a support arm that enables the device to be suspended in electrolyte and includes a drive for rotating the device at a selected rate.
Abstract: of EP0583057An instrument and method for measuring the throwing power (TP) of electroplating solutions under well-defined hydrodynamic conditions are described. The instrument (11) comprises an elongated cylinder of insulating material (13), an anode (14) mounted concentrically on the cylinder, and a pair of cathode elements (15,16) arranged below the anode. Cathode element (15) is fixed but the axial position of element (16) can be varied. A support arm (12) enables the device to be suspended in electrolyte and includes a drive for rotating the device at a selected rate, typically in the range 10-10.000 rpm corresponding to a solution velocity of 1-1.000 cmsl. A slip ring contact (17) provides current from the current supply (20) to the anode via anode lead (18) and electrical contact to the cathode elements is made via drive shaft (19). In use, pre-weighed copper foil is attached to cathode elements (15,16), the device rotated at fixed speed in the electrolyte and electrolytic deposition allowed to take place. TP is then calculated from the weight ratio of the deposits formed on the removable foil.