This review highlights various aspects of current palladium membrane research and serves as a comprehensive bibliography covering palladium membrane preparation methods and applications. There are many promising uses for palladium membranes, although widespread use of the available technologies is constrained primarily by the high cost of palladium, lack of durability due to hydrogen embrittlement, and susceptibility to fouling. Various researchers in the field are tackling these problems and fabricating thinner palladium alloy composite membranes that better withstand contaminantion and thermal cycling. What has been accomplished to address these issues and the directions presently being explored are discussed.

Innovations in palladium membrane research

A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

Light emitting device package

The invention provides methods and apparatus for nebulizing liquids. In one exemplary embodiment, an apparatus is provided which comprises a thin shell member having a front surface, a rear surface, and a plurality of apertures extending therebetween. The apertures are tapered to narrow from the rear surface to the front surface. A liquid supplier is further provided which delivers a predetermined unit volume of liquid to the rear surface. A vibrator vibrates the thin shell member to eject liquid droplets from the front surface of the thin shell member.

Liquid dispensing apparatus and methods

A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Lithographic contact elements

A system for intermittent delivery of an aerosolized medicament is disclosed. The system may include an aerosol generator, a controller and a conduit. The aerosol generator may be configured to aerosolize a medicament. The controller may be configured to receive physiological characteristic information about a patient, and control the aerosol generator based at least in part on the physiological characteristic information. The conduit may be configured to supply the aerosolized medicament to the patient's airway.

Methods and systems for operating an aerosol generator

A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

Multi-purpose finish for printed wiring boards and method of manufacture of such boards

A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate comprising immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition comprising a source of copper ions, an organic sulfonic acid or inorganic acid, or one or more organic compounds selected from among polarizers and/or depolarizers, and chloride ions.

Copper metallization of through silicon via

A packaged device with a lead frame, a lead frame and an article of manufacture comprising a base metal (20), a layer of nickel (21) on the base metal (20), and a protective composite of metal layers (22) on the nickel. The composite (22) includes, in succession from the nickel layer, a layer of palladium or soft gold strike (23), a layer of palladium-nickel alloy (24), a layer of palladium (25) and a layer of gold (26). The palladium or soft gold strike layer (23) acts primarily as a bonding (an adhesive) layer between the Ni (21) and Pd-Ni alloy layers (24) and as a layer that enhances reduction in porosity of subsequent layers, Pd-Ni alloy layer (24) acts as a trap for base metal ions, Pd layer (25) acts as a trap for Ni ions from the Pd-Ni alloy layer (24), and the outer gold layer (26) synergistically enhances the quality to the Pd layer (25). The various layers are in thickness sufficient to effectively accomplish each of their designated roles, depending on the processing and use conditions. Pd of soft Au strike layer (23) may be 1-5 microinches thick, Pd-Ni alloy layer (24) from 4 to 100 microinches, Pd layer (25) from 1 to 100 microinches and the outer gold layer (26) from 1 to 100 microinches in thickness.

Integrated Circuit Devices with Solderable Lead Frame

A process is described for electrolessly plating palladium metal on a variety of surfaces including palladium surfaces. The process involves use of a special electroless plating bath which is sufficiently stable for practical commercial use and yields excellent plating results. The plating bath contains a palladium salt and organic ligand. A narrow class of reducing agents is used including formaldehyde. The bath is made acid generally by the addition of nitric acid or hydrochloric acid. The process yields plating rates of about 6 microinches per minute and plating thicknesses in excess of 1 micrometer.

Electroless palladium process

An electroplating process is described for electroplating alloys of palladium and arsenic. The resulting electrodeposits are bright, ductile and remain ductile and crack-free even when the electrodeposits are quite thick. The deposits are quite hard and suitable for contact surfaces particularly in situations where wear characteristics require thick deposits. The electroplating process is also useful for making articles such as bellows by electroform procedures particularly since the electroplated material has extraordinary physical properties (good resilience, low stress and ductility) as well as good corrosion resistance.

Joseph Anthony Abys

Papers

Multi-purpose finish for printed wiring boards and method of manufacture of such boards

Copper metallization of through silicon via

Integrated Circuit Devices with Solderable Lead Frame

Electroless palladium process

Palladium alloy electroplating process