J
Joseph Anthony Abys
Researcher at Alcatel-Lucent
Publications - 103
Citations - 1171
Joseph Anthony Abys is an academic researcher from Alcatel-Lucent. The author has contributed to research in topics: Palladium & Electroplating. The author has an hindex of 21, co-authored 103 publications receiving 1167 citations. Previous affiliations of Joseph Anthony Abys include AT&T & Agere Systems.
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Patent
Multi-purpose finish for printed wiring boards and method of manufacture of such boards
TL;DR: A printed wiring board (PWB) as discussed by the authors is a substrate having a conductive trace located thereon and a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal.
Patent
Copper metallization of through silicon via
Thomas B. Richardson,Yun Zhang,Chen Wang,Vincent Paneccasio,Cai Wang,Xuan Lin,Richard Hurtubise,Joseph Anthony Abys +7 more
TL;DR: In this paper, a method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate comprising immersing the semiconductor IC device substrate into an electrolytic copper deposition composition comprising a source of copper ions, an organic sulfonic acid or inorganic acid, or one or more organic compounds selected from among polarizers and/or depolarizers, and chloride ions.
Patent
Integrated Circuit Devices with Solderable Lead Frame
TL;DR: In this article, the authors describe a composite of metal layers, which includes, in succession from the nickel layer, a layer of palladium or soft gold strike (23), an intermediate layer of Pd-Ni alloy (24) and an outer gold layer (26), which is used as a trap for base metal ions.
Patent
Electroless palladium process
TL;DR: In this article, a process for electrolessly plating palladium metal on a variety of surfaces including palladium surfaces is described, which involves use of a special electroless plating bath which is sufficiently stable for practical commercial use and yields excellent plating results.
Patent
Palladium alloy electroplating process
TL;DR: An electroplating process is described in this article for alloys of palladium and arsenic and the resulting electrodeposits are bright, ductile, and remain ductile and crack-free.