The technique of atom probe tomography (APT) is reviewed with an emphasis on illustrating what is possible with the technique both now and in the future. APT delivers the highest spatial resolution (sub-0.3-nm) three-dimensional compositional information of any microscopy technique. Recently, APT has changed dramatically with new hardware configurations that greatly simplify the technique and improve the rate of data acquisition. In addition, new methods have been developed to fabricate suitable specimens from new classes of materials. Applications of APT have expanded from structural metals and alloys to thin multilayer films on planar substrates, dielectric films, semiconducting structures and devices, and ceramic materials. This trend toward a broader range of materials and applications is likely to continue.

Invited review article: Atom probe tomography.

Get the phase diagram information you need at a price you can afford. Key Features: Peer reviewed by the Japanese Committee for Alloy Phase Diagrams. Updated through April 2000. Total number of diagrams = 2,332 (605 are new of greatly revised diagrams; among these 171 are not in Binary Alloy Phase Diagrams, 2nd Edition). Approximately 600 crystal structure tables of systems for which phase diagrams are unknown. You've been asking for a simple book containing just binary phase diagrams and crystal structure data. Desk Handbook: Phase Diagrams for Binary Alloys meets this need, and it presents the most current information. Updates the previous print compilation of binary phase diagrams by 10 years. Presents diagrams in consistent size. Shows the principal axis in atomic per cent, with a secondary axis in weight per cent. Includes an introductory article on phase diagrams and their use. Gives reference to the original literature source. This volume is the latest outgrowth of the phase diagram activity in which ASM International has been involved since 1978.

Desk handbook phase diagrams for binary alloys

Several FIB-based methods that have been developed to fabricate needle-shaped atom probe specimens from a variety of specimen geometries, and site-specific regions are reviewed. These methods have enabled electronic device structures to be characterized. The atom probe may be used to quantify the level and range of gallium implantation and has demonstrated that the use of low accelerating voltages during the final stages of milling can dramatically reduce the extent of gallium implantation.

https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1431927607070845

Review of Atom Probe FIB-Based Specimen Preparation Methods

Fe-based bulk metallic glasses: Glass formation, fabrication, properties and applications

The state of application of atom probe tomography to electronic materials is assessed. The benefits and challenges of the technique are discussed with regard to its impact on this field of materials science. Specimen preparation in particular is emphasized as the key to success with modern atom probes. Electronic materials referenced in this paper include components of complementary metal/oxide/semiconductor (CMOS) structures, compound semiconductors, and thin films for data storage and general applications. Many examples from recent work are provided as illustrations of the types of information that can be derived and the impact this information can have on the research, development, processing, and failure analysis of electronic materials.

K. Hildal

Papers

Critical cooling rate for Fe48Cr15Mo14Y2C15B6 bulk metallic glass formation

APT characterization of some iron-based bulk metallic glasses

Stability of the Nb5Si3 phase in the Nb–Mo–Si system

Enhanced oxidation resistance of high temperature Mo-Si-B alloys